Ryu, Dongsu
230  Ergebnisse:
Personensuche X
?
4

Laser assisted bonding (LAB) mechanism study on the effect ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Kim, GaHyeon ; Gim, MinHo ; Na, SeokHo... - p. 381-386 , 2023
 
?
5

Various Dicing Methods for Silicon Carbide Wafers:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Jeon, YuJin ; Na, SeokHo ; Gim, MinSoo... - p. 629-634 , 2023
 
?
 
?
8

Next Gen Laser Assisted Bonding (LAB) Technology:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Na, SeokHo ; Gim, MinHo ; Kim, ChoongHoe... - p. 1991-1995 , 2022
 
?
11

Reverse Laser Assisted Bonding (R-LAB) Technology for Chipl..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Na, SeokHo ; Gim, MinHo ; Kim, GaHyeon... - p. 414-417 , 2022
 
?
 
?
13

Exact solution of one-dimensional relativistic jet with rel..:

Joshi, Raj Kishor ; Chattopadhyay, Indranil ; Ryu, Dongsu.
Monthly Notices of the Royal Astronomical Society.  502 (2021)  4 - p. 5227-5244 , 2021
 
?
14

Time-resolved turbulent dynamo in a laser plasma:

Bott, Archie F. A. ; Tzeferacos, Petros ; Chen, Laura...
Proceedings of the National Academy of Sciences.  118 (2021)  11 - p. , 2021
 
1-15