Saha, R.K.
10593  Ergebnisse:
Personensuche X
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2

Performance Investigation of Robust Linearly Constrained Mi..:

, In: 2020 IEEE Region 10 Symposium (TENSYMP),
Chakrabarty, T. ; Saha, R. K. ; Faysal, M. F... - p. 1201-1204 , 2020
 
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3

Effects of feeding detoxified rubber seed meal on growth pe..:

Sharma, B.B. ; Saha, R.K. ; Saha, H.
Animal Feed Science and Technology.  193 (2014)  - p. 84-92 , 2014
 
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4

Study of Hydrodynamics and Dry Beneficiation Characteristic..:

Das, M. ; Meikap, B. C. ; Saha, R. K.
International Journal of Coal Preparation and Utilization.  33 (2013)  6 - p. 266-276 , 2013
 
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5

Inter-Species Transmission of the Epizootic Ulcerative Synd..:

Baruah, A. ; Saha, R.K. ; Kamilya, D.
Israeli Journal of Aquaculture - Bamidgeh.  64 (2012)  - p. , 2012
 
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6

Effect of applied current on the electrodeposited Ni–Al2O3 ..:

Saha, R.K. ; Khan, T.I.
Surface and Coatings Technology.  205 (2010)  3 - p. 890-895 , 2010
 
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7

Microstructural developments in TLP bonds using thin interl..:

Saha, R.K. ; Khan, T.I.
Materials Characterization.  60 (2009)  9 - p. 1001-1007 , 2009
 
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8

Prediction of Hydrodynamic Properties of Mixed-Particle Sys..:

Das, Mitali ; Meikap, B. C. ; Saha, R. K.
Industrial & Engineering Chemistry Research.  47 (2008)  14 - p. 4953-4961 , 2008
 
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9

A critical analysis of the acceleration length and pressure..:

Das, Mitali ; Meikap, B. C. ; Saha, R. K.
Asia-Pacific Journal of Chemical Engineering.  3 (2008)  5 - p. 560-571 , 2008
 
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11

Prediction of cluster diameter for a wide range of particle..:

Das, Mitali ; Meikap, B. C. ; Saha, R. K.
Asia-Pacific Journal of Chemical Engineering.  3 (2008)  2 - p. 223-229 , 2008
 
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12

Voidage and Pressure Profile Characteristics of Sand−Iron O..:

Das, M. ; Meikap, B. C. ; Saha, R. K.
Industrial & Engineering Chemistry Research.  47 (2008)  11 - p. 4018-4024 , 2008
 
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14

Effect of Bonding Temperature on Transient Liquid Phase Bon..:

Saha, R.K. ; Khan, T.I.
Journal of Materials Engineering and Performance.  15 (2006)  6 - p. 722-728 , 2006
 
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15

A comparison of microstructural developments in TLP diffusi..:

Saha, R.K. ; Wei, S. ; Khan, T.I.
Materials Science and Engineering: A.  406 (2005)  1-2 - p. 319-327 , 2005
 
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