E-LIB Suche - Ergebnisse für: Saka, Masumi

1

Plastic deformation affecting anodic dissolution in electro..:

Kimura, Yasuhiro ; Wakayama, Shoya ; Saka, Masumi
MRS Communications. 9 (2019) 2 - p. 773-777 , 2019

Link: https://doi.org/10.1557/..

2

Morphology control of hybrid Cu–Cu2O nanostructures fabrica..:

Aoki, Toshinori ; Li, Yuan ; Saka, Masumi
Materials Letters. 236 (2019) - p. 420-423 , 2019

Link: https://doi.org/10.1016/..

3

Ultrasonic-induced morphological change of micro/nanodeposi..:

Endo, Yusuke ; Kimura, Yasuhiro ; Saka, Masumi
MRS Communications. 9 (2019) 4 - p. 1331-1334 , 2019

Link: https://doi.org/10.1557/..

4

Enhanced fabrication of hybrid Cu-Cu2O nanostructures on el..:

FUKAYA, Shintaro ; AOKI, Toshinori ; KIMURA, Yasuhiro.
Mechanical Engineering Letters. 4 (2018) 0 - p. 17-00604-17-00604 , 2018

Link: https://doi.org/10.1299/..

5

Fabrication of large‐scale Ag micro/nanostructures using el..:

Nakakura, Teruki ; Saka, Masumi
Micro & Nano Letters. 13 (2018) 7 - p. 923-926 , 2018

Link: https://doi.org/10.1049/..

6

Characterization of the electrical and thermal properties o..:

Sasaki, Takahiro ; Li, Yuan ; Saka, Masumi
Microsystem Technologies. 24 (2018) 9 - p. 3907-3913 , 2018

Link: https://doi.org/10.1007/..

7

Controlling surface morphology of Sn thin-film to enhance c..:

Li, Yuan ; Matsuura, Ryo ; Saka, Masumi
Materials Research Bulletin. 87 (2017) - p. 155-160 , 2017

Link: https://doi.org/10.1016/..

8

Effect of temperature on preventing electromigration damage..:

IKADAI, Hiroto ; KIMURA, Yasuhiro ; SAKA, Masumi
Mechanical Engineering Letters. 2 (2016) 0 - p. 15-00714-15-00714 , 2016

Link: https://doi.org/10.1299/..

9

Forming long Ag thin wires by using stress migration:

Lu, Yebo ; Li, Yuan ; Saka, Masumi
Materials Letters. 171 (2016) - p. 72-74 , 2016

Link: https://doi.org/10.1016/..

10

Suitable passivation thickness on a metal line to prevent e..:

Kimura, Yasuhiro ; Ikadai, Hiroto ; Nakakura, Teruki.
Materials Letters. 184 (2016) - p. 219-222 , 2016

Link: https://doi.org/10.1016/..

11

Buried structure for increasing fabrication performance of ..:

Kimura, Yasuhiro ; Saka, Masumi
Japanese Journal of Applied Physics. 55 (2016) 6S1 - p. 06GH01 , 2016

Link: https://doi.org/10.7567/..

12

Influence of local thermal dissipation on electromigration ..:

Li, Yuan ; Lee, Hsin-Tzu ; Saka, Masumi
Microelectronics Reliability. 65 (2016) - p. 178-183 , 2016

Link: https://doi.org/10.1016/..

13

Theoretical consideration of electromigration damage around..:

Saka, Masumi ; Kimura, Yasuhiro ; Zhao, Xu
Microsystem Technologies. 23 (2016) 10 - p. 4523-4530 , 2016

Link: https://doi.org/10.1007/..

14

A direct current potential drop method for evaluating oxide..:

ANZAI, Hideya ; ISHIBASHI, Ryo ; SAKA, Masumi
Mechanical Engineering Letters. 2 (2016) 0 - p. 15-00632-15-00632 , 2016

Link: https://doi.org/10.1299/..

15

Influence of a hot and humid environment on thermal transpo..:

Li, Yuan ; Noguchi, Kyohei ; Saka, Masumi
Applied Surface Science. 368 (2016) - p. 267-271 , 2016

Link: https://doi.org/10.1016/..