Sammakia, Bahgat G.
84  Ergebnisse:
Personensuche X
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6

Degradation of Fan Performance in Cooling Electronics: Expe..:

Manaserh, Yaman.M. ; Tradat, Mohammad.I. ; Hoang, Cong Hiep...
International Journal of Heat and Mass Transfer.  174 (2021)  - p. 121291 , 2021
 
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7

Latency-Aware Dynamic Server and Cooling Capacity Provision..:

, In: Proceedings of the ACM Symposium on Cloud Computing,
Desu, Anuroop ; Puvvadi, Udaya ; Stachecki, Tyler... - p. 335-349 , 2021
 
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9

Novel Experimental Methodology for Characterizing Fan Perfo..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
 
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10

Establishing Thermal Air-cooled Limit for High Performance ..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Refai-Ahmed, Gamal ; Do, Hoa ; Hadad, Yaser... - p. 347-354 , 2020
 
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11

Establishing the Single-Phase Cooling Limit for Liquid-Cool..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Refai-Ahmed, Gamal ; Do, Hoa ; Hadad, Yaser... - p. 340-346 , 2020
 
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12

General Guidelines for Commercialization a Small-Scale In-R..:

, In: 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),
 
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13

Numerical Investigation of Novel Underfloor Air-Directors E..:

, In: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
 
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15

An Assessment of Risk of Fracture During Wirebond Over Acti..:

Upreti, Kritika ; Lin, Hung-Yun ; Subbarayan, Ganesh..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  6 (2016)  2 - p. 314-325 , 2016
 
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