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Sauli, Zaliman
38  Ergebnisse:
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1

Selective detection of amyloid fibrils by a dipole moment m..:

Adam, Hussaini ; Gopinath, Subash C.B. ; Kumarevel, Thirumananseri...
Process Biochemistry.  126 (2023)  - p. 23-32 , 2023
Link: https://doi.org/10.1016/..
 
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2

Integration of microfluidic channel on electrochemical-base..:

Adam, Hussaini ; Gopinath, Subash C.B. ; Md Arshad, M.K....
Journal of the Taiwan Institute of Chemical Engineers.  146 (2023)  - p. 104814 , 2023
Link: https://doi.org/10.1016/..
 
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3

Failure analysis on silicon semiconductor device materials:..:

Gopinath, Subash C.B. ; Ramanathan, Santheraleka ; Mohd Yasin, Mohd Najib...
Journal of Materials Research and Technology.  21 (2022)  - p. 3451-3461 , 2022
Link: https://doi.org/10.1016/..
 
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4

Reactive Ion Etching Parameter Effect on Aluminum Bond Pad ..:

Palianysamy, Moganraj ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 84-87 , 2014
Link: https://doi.org/10.4028/..
 
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5

Surface Roughness Influence on O2 and Ar RIE Gas Treated Al..:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 92-95 , 2014
Link: https://doi.org/10.4028/..
 
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6

Polymer Core BGA Stress Analysis at Higher Vertical Loading:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Vairavan, Rajendaran..
Procedia - Social and Behavioral Sciences.  129 (2014)  - p. 430-435 , 2014
Link: https://doi.org/10.1016/..
 
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7

Main Effects of Lattice Parameter in Ba0.65Sr0.35TiO3 Thin ..:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Palianysamy, Moganraj...
Procedia - Social and Behavioral Sciences.  129 (2014)  - p. 512-517 , 2014
Link: https://doi.org/10.1016/..
 
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8

Wire Bond Shear Test Simulation on Flat Surface Bond Pad:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Vairavan, Rajendaran..
Procedia - Social and Behavioral Sciences.  129 (2014)  - p. 328-333 , 2014
Link: https://doi.org/10.1016/..
 
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9

Chemical Bath Temperature Investigation for Electroless Nic..:

Retnasamy, Vithyacharan ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 96-100 , 2014
Link: https://doi.org/10.4028/..
 
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10

Effect of High Temperature during Electroless Nickel Proces:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 88-91 , 2014
Link: https://doi.org/10.4028/..
 
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11

Wettability and Surface Roughness Study on RIE Treated Alum..:

Retnasamy, Vithyacharan ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 101-104 , 2014
Link: https://doi.org/10.4028/..
 
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12

Reactive Ion Etching Parameter Effect on Aluminum Bond Pad ..:

Palianysamy, Moganraj ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 140-143 , 2014
Link: https://doi.org/10.4028/..
 
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13

Finite element analysis of thermal distributions of solder ..:

Boon Kar, Yap ; Azrina Talik, Noor ; Sauli, Zaliman..
Microelectronics International.  30 (2013)  1 - p. 14-18 , 2013
Link: https://doi.org/10.1108/..
 
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14

Ionic contaminations level and cleaning flip chip BGA packa..:

Boon Kar, Yap ; Azrina Talik, Noor ; Sauli, Zaliman...
Microelectronics International.  30 (2013)  2 - p. 99-103 , 2013
Link: https://doi.org/10.1108/..
 
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15

Nuclear matter properties, phenomenological theory of clust..:

Usmani, Q. N. ; Abdullah, Nooraihan ; Anwar, K..
Physical Review C.  84 (2011)  6 - p. , 2011
Link: https://doi.org/10.1103/..
 
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