Saw, Lip Teng
131  Ergebnisse:
Personensuche X
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3

Mitigating Solder Beading in Non-Eutectic Low-Temperature S..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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4

Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lip Teng, Saw ; Devarajan, Mutharasu - p. 1750-1753 , 2022
 
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5

Effect of filler size and loading on thermo-mechanical degr..:

Teng Saw, Lip ; Zainuddin, Firuz ; Xuan Viet, Cao.
IOP Conference Series: Materials Science and Engineering.  864 (2020)  1 - p. 012114 , 2020
 
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11

Numerical simulation of a pioneering cool roof system for A..:

Ho, Mun Ling ; Yew, Ming Chian ; Yew, Ming Kun...
Alexandria Engineering Journal.  102 (2024)  - p. 211-222 , 2024
 
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