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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
2
Multi-purpose Thermal Test Vehicle for Experimental Investi..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
Realization, multi-field coupled simulation and characteriz..:
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2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
5
Experimental Investigation of Pumped Two-Phase Flow Boiling..:
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2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
6
SPICE model extension to simulate the transient coupled ele..:
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10
Teilvorhaben Aufbau- und Verbindungstechnik für modulare H..
Abschlussdokumentation ; Laufzeit: 01.12.2001 bis 31.12.200