Schein, Friedrich-Leonhard
78  Ergebnisse:
Personensuche X
?
1

Dry etch processing in fan-out panel-level packaging - An a..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
?
2

Panel Level Packaging – Where are the Technology Limits?:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Obst, Mattis... - p. 807-818 , 2022
 
?
3

Process Modules for High-Density Interconnects in Panel-Lev..:

Schein, Friedrich-Leonhard ; Kahle, Ruben ; Kunz, Marc...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  10 (2020)  1 - p. 5-10 , 2020
 
?
4

Evaluation of adaptive processes for the embedding of bare ..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
?
5

High Density Fan-Out Panel Level Packaging of Multiple Dies..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
?
7

Oxide bipolar electronics: materials, devices and circuits:

Grundmann, Marius ; Klüpfel, Fabian ; Karsthof, Robert...
Journal of Physics D: Applied Physics.  49 (2016)  21 - p. 213001 , 2016
 
1-15