Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Schjølberg-Henriksen, Kari
51  Ergebnisse:
Personensuche X
?
1

The Synergistic Roles of Temperature and Pressure in Thermo..:

Ambhore, Pranav ; Mani, Karthick ; Beekley, Brett...
ECS Transactions.  86 (2018)  5 - p. 129-135 , 2018
Link: https://doi.org/10.1149/..
 
?
2

Texture of Al films for wafer-level thermocompression bondi..:

Malik, Nishant ; Venkatachalapathy, Vishnukanthan ; Dall, Wilhelm...
Superlattices and Microstructures.  106 (2017)  - p. 216-233 , 2017
Link: https://doi.org/10.1016/..
 
?
3

Characterization of interfacial morphology of low temperatu..:

Goorsky, Mark S. ; Schjølberg-Henriksen, Kari ; Beekley, Brett...
Japanese Journal of Applied Physics.  57 (2017)  2S1 - p. 02BC03 , 2017
Link: https://doi.org/10.7567/..
 
?
4

Low-Temperature Aluminum-Aluminum Wafer Bonding:

Rebhan, Bernhard ; Hinterreiter, Andreas ; Malik, Nishant...
ECS Transactions.  75 (2016)  9 - p. 15-24 , 2016
Link: https://doi.org/10.1149/..
 
?
5

Conductivity of high-temperature annealed silicon direct wa..:

Schjølberg-Henriksen, Kari ; Tvedt, Lars Geir Whist ; Gjelstad, Stein Are...
Microsystem Technologies.  21 (2015)  5 - p. 979-985 , 2015
Link: https://doi.org/10.1007/..
 
?
6

Impact of SiO2on Al–Al thermocompression wafer bonding:

Malik, Nishant ; Schjølberg-Henriksen, Kari ; Poppe, Erik U..
Journal of Micromechanics and Microengineering.  25 (2015)  3 - p. 035025 , 2015
Link: https://doi.org/10.1088/..
 
?
7

Electrical, Mechanical, and Hermeticity Properties of Low-T..:

Schjølberg-Henriksen, Kari ; Malik, Nishant ; Gundersen, Elin Vold...
ECS Transactions.  64 (2014)  5 - p. 275-284 , 2014
Link: https://doi.org/10.1149/..
 
?
8

Hermeticity and Reliability of Al-Al Thermocompression Wafe..:

Malik, Nisant ; Poppe, Erik ; Schjolberg-Henriksen, Kari..
ECS Transactions.  64 (2014)  5 - p. 149-160 , 2014
Link: https://doi.org/10.1149/..
 
?
9

Wafer-level Au–Au bonding in the 350–450 °C temperature ran..:

Tofteberg, Hannah R ; Schjølberg-Henriksen, Kari ; Fasting, Eivind J...
Journal of Micromechanics and Microengineering.  24 (2014)  8 - p. 084002 , 2014
Link: https://doi.org/10.1088/..
 
?
10

Hermeticity and Reliability of Au-Au Thermocompression Bond..:

Malik, Nisant ; Tofteberg, Hannah ; Poppe, Erik..
ECS Transactions.  64 (2014)  5 - p. 167-176 , 2014
Link: https://doi.org/10.1149/..
 
?
11

Leak Rates and Residual Gas Pressure in Cavities Sealed by ..:

Schjølberg-Henriksen, Kari ; Malik, Nishant ; Sandvand, Asmund..
ECS Transactions.  64 (2014)  5 - p. 305-314 , 2014
Link: https://doi.org/10.1149/..
 
?
12

Die shear strength as a function of bond frame geometry — A..:

, In: 2012 4th Electronic System-Integration Technology Conference,
Tollefsen, Torleif Andre ; Larsson, Andreas ; Taklo, Maaike Margrete Visser.. - p. 1-6 , 2012
Link: https://doi.org/10.1109/..
 
?
13

(Invited) 3D Interconnect Technologies for Advanced MEMS/NE..:

Lietaer, Nicolas ; Taklo, Maaike ; Schjo̸lberg-Henriksen, Kari.
ECS Transactions.  25 (2010)  38 - p. 87-95 , 2010
Link: https://doi.org/10.1149/..
 
?
14

Resist evaluation for fabrication of diffractive optical el..:

Herbjørnrød, Aina ; Schjølberg-Henriksen, Kari ; Angelskår, Hallvard.
Journal of Micromechanics and Microengineering.  19 (2009)  12 - p. 125022 , 2009
Link: https://doi.org/10.1088/..
 
?
15

Low-temperature plasma activated bonding for a variable opt..:

Schjølberg-Henriksen, Kari ; Moe, Sigurd ; Taklo, Maaike M. Visser..
Sensors and Actuators A: Physical.  142 (2008)  1 - p. 413-420 , 2008
Link: https://doi.org/10.1016/..
 
1-15