Personensuche
X
?
2024 International Conference on Electronics Packaging (ICEP) ,
2
Plasma Cleaning and Thermal Compression Bonding of Indium B..:
, In:
?
Proceedings of the 2024 ACM Designing Interactive Systems Conference ,
4
Text-to-Image AI as a Catalyst for Semantic Convergence in ..:
, In:
?
Stable Klingen Vectors and Paramodular Newforms; Lecture Notes in Mathematics ,
9
Background on Siegel Modular Forms:
, In:
?
Stable Klingen Vectors and Paramodular Newforms; Lecture Notes in Mathematics ,
10
Further Results About Generic Representations:
, In:
?
Stable Klingen Vectors and Paramodular Newforms; Lecture Notes in Mathematics ,
11
Hecke Eigenvalues and Minimal Levels:
, In:
?
Stable Klingen Vectors and Paramodular Newforms; Lecture Notes in Mathematics ,
12
Some Induced Representations:
, In:
?
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
14
Influence of the Bond Foot Angle on Active Power Cycling Li..:
, In:
?
Stable Klingen Vectors and Paramodular Newforms; Lecture Notes in Mathematics ,
15