Scognamillo, Ciro
41  Ergebnisse:
Personensuche X
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1

Enhancing Electrical Ruggedness in Double-Sided Cooled Powe..:

, In: 2024 19th Conference on Ph.D Research in Microelectronics and Electronics (PRIME),
 
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2

Fast Error-Bounded MOR-Based Approximation of Heat Conducti..:

, In: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI),
 
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4

Design and Optimization of 3.3 kV Silicon Carbide Semi-Supe..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Melnyk, Kyrylo ; Renz, Arne Benjamin ; Cao, Qinze... - p. 132-135 , 2024
 
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5

Improving the thermal ruggedness of GaAs HBTs through nonun..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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6

On-Chip Spike Detection and Classification using Neural Net..:

, In: 2023 IEEE Biomedical Circuits and Systems Conference (BioCAS),
 
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7

Structure Curve Representation of Dynamic Thermal Multi-Por..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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8

Improved nonlinear electrothermal simulation of bipolar tra..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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9

Coupled structural and functional characterization and mode..:

, In: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
 
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10

Boundary Condition Independent Compact Thermal Models Enhan..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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11

Thermo-Electrochemical FEM and Circuit Simulations of Li-Io..:

Catalano, Antonio Pio ; Scognamillo, Ciro ; Piccirillo, Francesco...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  8 - p. 1088-1095 , 2023
 
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12

Improving Performance of InGaP/GaAs HBT Arrays by means of ..:

, In: 2023 18th Conference on Ph.D Research in Microelectronics and Electronics (PRIME),
 
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14

Validation of Thermometer-Based Techniques to Experimentall..:

, In: Lecture Notes in Electrical Engineering; Proceedings of SIE 2023,
 
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