Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Serbulova, K.
6  Ergebnisse:
Personensuche X
?
1

CMOS Scaling by Nanosheet Device Architectures and Backside..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Horiguchi, N. ; Mertens, H. ; Ritzenthaler, R.... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
?
2

Impact of Backside Power Delivery Network with Buried Power..:

, In: 2023 45th Annual EOS/ESD Symposium (EOS/ESD),
Serbulova, K. ; Chen, S.-H. ; Hellings, G.... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
?
3

Backside Power Delivery: Game Changer and Key Enabler of Ad..:

, In: 2023 International Electron Devices Meeting (IEDM),
Veloso, A. ; Vermeersch, B. ; Chen, R.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
4

ESD Challenges in 300nm Si Substrate of DTCO/STCO Scaling O..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chen, W.-C. ; Chen, S.-H. ; Veloso, A.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
5

Upcoming Challenges of ESD Reliability in DTCO with BS-PDN ..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chen, W.-C. ; Chen, S.-H. ; Veloso, A.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
?
6

Enabling Active Backside Technology for ESD and LU Reliabil..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Serbulova, K. ; Chen, S.-H. ; Hellings, G.... - p. 431-432 , 2022
Link: https://doi.org/10.1109/..
 
1-6