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2020 IEEE Far East NDT New Technology & Application Forum (FENDT) ,
1
Mirror Aided Ultrasonic Testing of the bonding interface of..:
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2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS) ,
13
Ultra-low $I_{Q}$ Fully Integrated NMOS LDO with Enhanced L..:
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2022 IEEE International Symposium on Circuits and Systems (ISCAS) ,
14
High Sensitivity Near-zero Power Wakeup Receiver for Backsc..:
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2021 IEEE International Symposium on Medical Measurements and Applications (MeMeA) ,
15