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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
An Advanced Packaging Figure of Merit (AP-FoM) for Benchmar..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
2
Signal and Power Integrity Performance of CoWoS-R in Chiple..:
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2011 International Conference on Technologies and Applications of Artificial Intelligence ,
14
Graphics/Image Retrieval Method:
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2010 IEEE International Conference on Intelligent Computing and Intelligent Systems ,
15