Personensuche
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Modeling and Analysis of Heterogeneously Integrated Chiplet..:
, In:
?
2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) ,
2
Signal and Power Integrity Co-Simulation of Chiplet-to-Chip..:
, In:
?
2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) ,
3
Fast Latency-Insertion-Method-Based Eye Diagram Simulation ..:
, In:
?
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
4
Minimum Cursors Selection in Statistical Method for Eye Dia..:
, In:
?
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023 ,
5
Constrained Gaussian Process for Signal Integrity applicati..:
, In:
?
2022 IEEE 26th Workshop on Signal and Power Integrity (SPI) ,
6
Channel Inverse Design Using Tandem Neural Network:
, In:
?
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
7
Statistical Method for Eye Diagram Simulation in a High-Spe..:
, In:
?
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
8
Fast Eye Diagram Simulation based on Latency Insertion Meth..:
, In:
?
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
10