E-LIB Suche - Ergebnisse für: Shi, Hongbin

1

Board Level Solder Joint Thermal Fatigue Reliability Improv..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Li, Mengyuan ; Shi, Hongbin ; Lv, Xiang - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

2

Study on board-level reliability of passive components on u..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Lv, Xiang ; Shi, Hongbin ; Li, Mengyuan.. - p. 57-62 , 2023

Link: https://doi.org/10.1109/..

3

Improving Board Level Reliability of Ultra Thin PCBA by Sys..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Jiang, Yiming ; Shi, Hongbin ; Li, Mengyuan. - p. 922-925 , 2023

Link: https://doi.org/10.1109/..

4

Prediction of compressive strength of concrete for high-per..:

Ding, Baorong ; Wang, Qiong ; Ma, Yue.
Multiscale and Multidisciplinary Modeling, Experiments and Design. 7 (2023) 2 - p. 961-974 , 2023

Link: https://doi.org/10.1007/..

5

Underfill Flow Numerical Simulation for Achieving Board Lev..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Jiang, Yiming ; Shi, Hongbin ; Lv, Xiang - p. 1-7 , 2023

Link: https://doi.org/10.1109/..

6

A Study on the Accessibility of the Emergency Medical Servi..:

Shi, Hongbin ; Zhou, Miao ; Kong, Nana..
Sustainability. 15 (2023) 13 - p. 10443 , 2023

Link: https://doi.org/10.3390/..

7

Teeth U-Net: A segmentation model of dental panoramic X-ray..:

Hou, Senbao ; Zhou, Tao ; Liu, Yuncan...
Computers in Biology and Medicine. 152 (2023) - p. 106296 , 2023

Link: https://doi.org/10.1016/..

8

Deep learning method to optimize the quality of services in..:

Qian, Yuelei ; Liu, Guangchun ; Shi, Hongbin
Wireless Networks. , 2023

Link: https://doi.org/10.1007/..

9

Mining Weak Relations Between Reviews for Opinion Spam Dete..:

Xu, Yingrui ; Liu, Hao ; Ge, Jingguo...
IEEE/ACM Transactions on Audio, Speech, and Language Processing. 31 (2023) - p. 152-162 , 2023

Link: https://doi.org/10.1109/..

10

Influence of nozzle structure and process parameters for 3D..:

Song, Shixiong ; Ren, Quanbin ; Shi, Jiawei.
Journal of Physics: Conference Series. 2557 (2023) 1 - p. 012005 , 2023

Link: https://doi.org/10.1088/..

11

A method of UAV visible light remote sensing image registra..:

Qian, Yuelei ; Shi, Hongbin ; Liu, Guangchun
Results in Engineering. 20 (2023) - p. 101601 , 2023

Link: https://doi.org/10.1016/..

12

The potential of Lycium barbarum miR166a in kidney cancer t..:

Zhang, Qiang ; Xie, Zhiyuan ; Li, Yan...
Experimental Cell Research. 423 (2023) 1 - p. 113455 , 2023

Link: https://doi.org/10.1016/..

13

Realizing ultra-thin high reliability storage devices with ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Shi, Hongbin ; Yang, Chao ; Zhang, Jianrui - p. 614-619 , 2023

Link: https://doi.org/10.1109/..

14

Structure evolution and electric‐field‐induced reversible t..:

Tian, Ye ; Li, Lei ; Geng, Jia...
Journal of the American Ceramic Society. 106 (2023) 10 - p. 5907-5921 , 2023

Link: https://doi.org/10.1111/..

15

Rapid model generation and analysis of mechanical behaviour..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),

Long, Xu ; Ding, Xiaoyue ; Su, Yutai... - p. 1-4 , 2022

Link: https://doi.org/10.1109/..