Shi, Jian-Kun
12454  Ergebnisse:
Personensuche X
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8

Optimization of Shallow Trench Isolation CD micro loading i..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
 
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9

Research of ultra high aspect ratio silicon etching in the ..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Ji, Zheng ; Zhang, Jian-kun ; Yang, Guang... - p. 1-3 , 2022
 
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10

SNC SADP Spacer etch process development using carbon hard ..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Liu, Hao ; Zhang, Jian-kun ; Zhao, Zun-hua... - p. 1-3 , 2022
 
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12

Microstructure and properties of nano-laminated Y3Si2C2 cer..:

Shi, Lin-Kun ; Zhou, Xiaobing ; Dai, Jian-Qing...
Journal of Advanced Ceramics.  10 (2021)  3 - p. 578-586 , 2021
 
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14

Thermal stability of Mo C alloy Schottky contacts on n-type..:

Yang, Zhao-Yang ; Wang, Ying ; Li, Xing-ji...
Microelectronic Engineering.  239-240 (2021)  - p. 111531 , 2021
 
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