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Shie, Kai-cheng
416  Ergebnisse:
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1

Stress Relaxation and Grain Growth Behaviors of (111)-Prefe..:

Lai, Jyun-Yu ; Tran, Dinh-Phuc ; Yang, Shih-Chi...
Nanomaterials.  13 (2023)  4 - p. 709 , 2023
Link: https://doi.org/10.3390/..
 
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2

Low Contact Resistance and Low Temperature Hybrid Bonding w..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
He, Pin-Syuan ; Shie, Kai-Cheng ; Chen, Chih - p. 321-323 , 2023
Link: https://doi.org/10.1109/..
 
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3

High-Bonding-Strength Polyimide Films Achieved via Thermal ..:

He, Pin-Syuan ; Tran, Dinh-Phuc ; Kuo, Ting-Yu...
Nanomaterials.  13 (2023)  9 - p. 1575 , 2023
Link: https://doi.org/10.3390/..
 
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4

Non-destructive micro analysis of electromigration failures..:

Tran, Dinh-Phuc ; Lin, Tzu-Wen ; Shie, Kai-Cheng.
Materials Characterization.  194 (2022)  - p. 112404 , 2022
Link: https://doi.org/10.1016/..
 
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5

Effect of Tin Grain Orientation on Electromigration-Induced..:

Hsu, Po-Ning ; Lee, Dai-Lung ; Tran, Dinh-Phuc...
Materials.  15 (2022)  20 - p. 7115 , 2022
Link: https://doi.org/10.3390/..
 
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6

Failures of Cu-Cu Joints under Temperature Cycling Tests:

Hsu, Po-Ning ; Shie, Kai-Cheng ; Tran, Dinh-Phuc..
Materials.  15 (2022)  14 - p. 4944 , 2022
Link: https://doi.org/10.3390/..
 
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7

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Res..:

Ong, Jia-Juen ; Chiu, Wei-Lan ; Lee, Ou-Hsiang...
Materials.  15 (2022)  5 - p. 1888 , 2022
Link: https://doi.org/10.3390/..
 
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8

Artificial intelligence deep learning for 3D IC reliability..:

Hsu, Po-Ning ; Shie, Kai-Cheng ; Chen, Kuan-Peng...
Scientific Reports.  12 (2022)  1 - p. , 2022
Link: https://doi.org/10.1038/..
 
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9

Enhancement of fatigue resistance by recrystallization and ..:

Ong, Jia-Juen ; Tran, Dinh-Phuc ; Lan, Man-Chi...
Scientific Reports.  12 (2022)  1 - p. , 2022
Link: https://doi.org/10.1038/..
 
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10

Modeling of Cu-Cu Thermal Compression Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Shie, Kai-Cheng ; Tran, Dinh-Phuc ; Gusak, A. M.... - p. 2201-2205 , 2022
Link: https://doi.org/10.1109/..
 
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11

Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling:

Shie, Kai-Cheng ; Hsu, Po-Ning ; Li, Yu-Jin..
Materials.  14 (2021)  19 - p. 5522 , 2021
Link: https://doi.org/10.3390/..
 
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12

Effect of Bonding Strength on Electromigration Failure in C..:

Shie, Kai-Cheng ; Hsu, Po-Ning ; Li, Yu-Jin..
Materials.  14 (2021)  21 - p. 6394 , 2021
Link: https://doi.org/10.3390/..
 
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13

Shearing Characteristics of Cu-Cu Joints Fabricated by Two-..:

Ong, Jia-Juen ; Tran, Dinh-Phuc ; Yang, Shih-Chi..
Metals.  11 (2021)  11 - p. 1864 , 2021
Link: https://doi.org/10.3390/..
 
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14

A kinetic model of copper-to-copper direct bonding under th..:

Shie, Kai-Cheng ; Gusak, A.M. ; Tu, K.N..
Journal of Materials Research and Technology.  15 (2021)  - p. 2332-2344 , 2021
Link: https://doi.org/10.1016/..
 
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15

Reliability of Instant Bonding of Cu-Cu joints: Thermal Cyc..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Shie, Kai-Cheng ; Hsu, Po-Ning ; Li, Yu-Jin.. - p. 91-94 , 2020
Link: https://doi.org/10.1109/..
 
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