Shih-Kang Lin
17712  Ergebnisse:
Personensuche X
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3

Reducing anisotropy of rhombohedral Bi-rich phase for high-..:

Yang, Chih-han ; Liu, Yu-chen ; Nishikawa, Hiroshi.
Journal of Materials Research and Technology.  30 (2024)  - p. 16-24 , 2024
 
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6

An Investigation of Cu/Ni/Ga Interfacial Reaction with Diff..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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12

Insights into the Structural and Thermodynamic Instability ..:

Tran, Ngoc Thanh Thuy ; Lin, Che-an ; Lin, Shih-kang
ACS Sustainable Chemistry & Engineering.  11 (2023)  18 - p. 6978-6987 , 2023
 
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14

How to enhance Sn-Bi low-temperature solder by alloying?:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Shih-Kang ; Yang, Chih-Han ; Liu, Yu-Chen.. - p. 53-54 , 2023
 
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