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Shim, Da Eun
3251  Ergebnisse:
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1

Impact of Technology Scaling and Back-End-of-the-Line Techn..:

Kumar, Piyush ; Shim, Da Eun ; Narla, Siri.
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits.  10 (2024)  - p. 13-21 , 2024
Link: https://doi.org/10.1109/..
 
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2

Signal-Power Interconnect Co-Design Based on Various Techno..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Shim, Da Eun ; Kini, Akshata Ashok ; Mallikarjuna, Meghana.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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3

GNN-based Multi-bit Flip-flop Clustering and Post-clusterin..:

Vanna-Iampikul, Pruek ; Lu, Yi-Chen ; Shim, Da Eun.
ACM Transactions on Design Automation of Electronic Systems.  28 (2023)  5 - p. 1-26 , 2023
Link: https://doi.org/10.1145/..
 
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4

A Comprehensive Modeling Platform for Interconnect Technolo..:

Shim, Da Eun ; Huang, Victor ; Chen, Xinkang..
IEEE Transactions on Electron Devices.  70 (2023)  5 - p. 2594-2599 , 2023
Link: https://doi.org/10.1109/..
 
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5

Exploring FinFET and Gate-All-Around FET for SRAM Cell Arra..:

, In: 2023 IEEE International Opportunity Research Scholars Symposium (ORSS),
Bush, Bennett ; Mack, Jacob ; Hanks, Luke... - p. 43-46 , 2023
Link: https://doi.org/10.1109/..
 
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6

LCP: A Low-Communication Parallelization Method for Fast Ne..:

, In: 2023 Congress in Computer Science, Computer Engineering, & Applied Computing (CSCE),
Hadidi, Ramyad ; Asgari, Bahar ; Cao, Jiashen... - p. 1670-1677 , 2023
Link: https://doi.org/10.1109/..
 
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7

Improving SRAM Performance With Different Interconnect Opti..:

, In: 2022 Opportunity Research Scholars Symposium (ORSS),
Mack, Jacob ; Datta, Rudranshu ; Young, Brandon... - p. 38-40 , 2022
Link: https://doi.org/10.1109/..
 
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8

Balancing Interconnect Resistance and Capacitance at the Ad..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Shim, Da Eun ; Naeemi, Azad - p. 64-66 , 2022
Link: https://doi.org/10.1109/..
 
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9

Pseudo-3D Physical Design Flow for Monolithic 3D ICs: Compa..:

Park, Heechun ; Ku, Bon Woong ; Chang, Kyungwook..
ACM Transactions on Design Automation of Electronic Systems.  26 (2021)  5 - p. 1-25 , 2021
Link: https://doi.org/10.1145/..
 
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10

A Fault-Tolerant and High-Speed Memory Controller Targeting..:

, In: 2020 IEEE 38th International Conference on Computer Design (ICCD),
Agnesina, Anthony ; Shim, Da Eun ; Yamaguchi, James... - p. 425-432 , 2020
Link: https://doi.org/10.1109/..
 
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11

Macro-3D : a physical design methodology for face-to-fac..:

, In: Proceedings of the 23rd Conference on Design, Automation and Test in Europe,
Bamberg, Lennart ; García-Ortiz, Alberto ; Zhu, Lingjun... - p. 37-42 , 2020
Link: https://dl.acm.org/doi/1..
 
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12

Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool F..:

, In: Proceedings of the 2020 International Symposium on Physical Design,
Park, Heechun ; Ku, Bon Woong ; Chang, Kyungwook.. - p. 47-54 , 2020
Link: https://dl.acm.org/doi/1..
 
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13

Hot Chips 2020 Posters:

, In: 2020 IEEE Hot Chips 32 Symposium (HCS),
Elsabbagh, Fares ; Tine, Blaise ; Chawda, Apurve... - p. 1-159 , 2020
Link: https://doi.org/10.1109/..
 
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14

Macro-3D: A Physical Design Methodology for Face-to-Face-St..:

, In: 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Bamberg, Lennart ; Garcia-Ortiz, Alberto ; Zhu, Lingjun... - p. 37-42 , 2020
Link: https://doi.org/10.23919..
 
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15

Logic Monolithic 3D ICs : PPA Benefits and EDA Tools Nec..:

, In: Proceedings of the 2019 Great Lakes Symposium on VLSI,
Pentapati, Sai Surya Kiran ; Shim, Da Eun ; Lim, Sung Kyu - p. 445-450 , 2019
Link: https://dl.acm.org/doi/1..
 
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