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Sikka, Kamal
26  Ergebnisse:
Personensuche X
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1

Shape optimization of hotspot targeted micro pin fins for h..:

Fallahtafti, Najmeh ; Rangarajan, Srikanth ; Hadad, Yaser...
International Journal of Heat and Mass Transfer.  192 (2022)  - p. 122897 , 2022
Link: https://doi.org/10.1016/..
 
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2

Super Fine Jet Underfill Dispense Technique for Robust Micr..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Marushima, Chinami ; Watanabe, Takahito... - p. 631-634 , 2022
Link: https://doi.org/10.1109/..
 
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3

Design and Thermal Analysis of a 3-D Printed Impingement Pi..:

Hoang, Cong Hiep ; Azizi, Arad ; Fallahtafti, Najmeh...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  7 - p. 1091-1099 , 2022
Link: https://doi.org/10.1109/..
 
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4

Dimensional Parameters Controlling Capillary Underfill Flow..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Marushima, Chinami ; Aoki, Toyohiro ; Nakamura, Koki... - p. 586-590 , 2022
Link: https://doi.org/10.1109/..
 
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5

Reworkable & rehealable packaging materials from the introd..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Magbitang, Teddie ; Moore, Lucas ; Yu, Roy... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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6

Layered Unsupervised Learning-based Identification and Quan..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Lall, Rahul ; Sikka, Kamal ; de Sousa, Isabel - p. 1-9 , 2022
Link: https://doi.org/10.1109/..
 
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7

Surface Silicon Bridge Direct Bonded Heterogeneous Integrat..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Sikka, Kamal ; Sousa, Isabel De ; Jain, Aakrati... - p. 145-147 , 2022
Link: https://doi.org/10.1109/..
 
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8

Characterization of Non-Conductive Paste Materials (NCP) fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Watanabe, Takahito ; Marushima, Chinami... - p. 625-630 , 2022
Link: https://doi.org/10.1109/..
 
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9

Thermal modeling of Direct Bonded Heterogenous Integration ..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Miyazawa, Risa ; Hisada, Takashi ; Bergendah, Marc.. - p. 1-9 , 2022
Link: https://doi.org/10.1109/..
 
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10

Thermo-mechanical Analysis of Thermal Compression Bonding C..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chowdhury, Prabudhya Roy ; Sakuma, Katsuyuki ; Raghavan, Sathya... - p. 579-585 , 2022
Link: https://doi.org/10.1109/..
 
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11

A Laser Dicing Method for Plus-Shaped Dies for Heterogenous..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jain, Aakrati ; Sikka, Kamal ; Li, Shidong... - p. 24-29 , 2022
Link: https://doi.org/10.1109/..
 
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12

Multi-objective optimization of a chip-attached micro pin f..:

Radmard, Vahideh ; Hadad, Yaser ; Rangarajan, Srikanth...
Applied Thermal Engineering.  195 (2021)  - p. 117187 , 2021
Link: https://doi.org/10.1016/..
 
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13

Artificial Neural Networks for Package Thermal Analysis:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Sikka, Kamal ; Lall, Rahul ; Sinha, Tuhin - p. 103-113 , 2021
Link: https://doi.org/10.1109/..
 
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14

Impact of fin geometry and surface roughness on performance..:

Hoang, Cong Hiep ; Fallahtafti, Najmeh ; Rangarajan, Srikanth...
Applied Thermal Engineering.  198 (2021)  - p. 117453 , 2021
Link: https://doi.org/10.1016/..
 
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15

An Experimental Apparatus for Two-phase Cooling of High Hea..:

, In: 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),
Hoang, Cong Hiep ; Khalili, Sadegh ; Ramakrisnan, Bharath... - p. 32-38 , 2020
Link: https://doi.org/10.23919..
 
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