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Singh, Navab
135  Ergebnisse:
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1

Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Van Nhat Anh, Tran ; Guan, Chen Gim... - p. 1880-1884 , 2024
Link: https://doi.org/10.1109/..
 
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2

Cu/Dielectric hybrid bonding among Glass and Si:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Sundaram, Arvind ; Van Nhat Anh, Tran... - p. 1543-1547 , 2024
Link: https://doi.org/10.1109/..
 
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3

Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Sundaram, Arvind ; Sandra, San... - p. 803-808 , 2024
Link: https://doi.org/10.1109/..
 
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4

First Demonstration of High‐Frequency InAlN/GaN High‐Electr..:

Li, Hanchao ; Xie, Hanlin ; Wang, Yue...
physica status solidi (a).  , 2024
Link: https://doi.org/10.1002/..
 
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5

Dominant higher-order vortex gyromodes in circular magnetic..:

Bondarenko, Artem V. ; Bunyaev, Sergey A. ; Shukla, Amit K....
Nanoscale Horizons.  , 2024
Link: https://doi.org/10.1039/..
 
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6

Improvement of Interface Properties for Thermally Oxidized ..:

Chand, Umesh ; Bera, Lakshmi Kanta ; Singh, Navab...
Materials Science Forum.  1090 (2023)  - p. 141-145 , 2023
Link: https://doi.org/10.4028/..
 
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7

Cu and barrier CMP process development with fine 1μm Cu bon..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Roy, Sangita Chaki ; Guan, Chen Gim ; Venkataraman, Nandini.. - p. 135-138 , 2023
Link: https://doi.org/10.1109/..
 
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8

Doping-selective etching of silicon for wafer thinning in t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Venkataraman, Nandini ; Risse, Benedikt ; Decierdo, Gregorio... - p. 1524-1530 , 2023
Link: https://doi.org/10.1109/..
 
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9

CMOS-Compatible Fine Pitch Al-Al Bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Cheemalamarri, Hemanth Kumar ; Varghese, Binni ; Jaibir, Sharma... - p. 1725-1729 , 2023
Link: https://doi.org/10.1109/..
 
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10

Alignment through thick Si layer for high resolution patter..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sundaram, Arvind ; Tew, Chin Khang ; Tan, Guo Wei... - p. 1150-1155 , 2023
Link: https://doi.org/10.1109/..
 
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11

Ultrathin New Dielectric Interlayer Layer - Enhancer for TE..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Cheemalamarri, Hemanth Kumar ; Lee Hou Jang, Steven ; Miao, Ji Hong... - p. 625-628 , 2023
Link: https://doi.org/10.1109/..
 
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12

Patterning on reflective (Al) surface using auto alignment ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sundaram, Arvind ; Pitchappa, Prakash ; Zhonghua, Gu.. - p. 603-607 , 2023
Link: https://doi.org/10.1109/..
 
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13

Investigation of Immersion Alignment Mark Signal and Alignm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tew, Chin Khang ; Tobing, Landobasa Y. M. ; Yoo, Jae Ok. - p. 592-595 , 2023
Link: https://doi.org/10.1109/..
 
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14

Defect evolution during through-silicon via copper electrop..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Van Nhat Anh, Tran ; Venkataraman, Nandini ; Tao, Meng... - p. 1059-1062 , 2023
Link: https://doi.org/10.1109/..
 
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15

Gate Dielectric Current Transport Mechanisms in N-SiC Metal..:

Chand, Umesh ; Bera, Lakshmi Kanta ; Singh, Navab...
Materials Science Forum.  1090 (2023)  - p. 165-169 , 2023
Link: https://doi.org/10.4028/..
 
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