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2024 International Conference on Electronics Packaging (ICEP) ,
1
Comparing Electromigration in Tin-Bismuth Alloys using plan..:
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2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific) ,
2
In Situ Study of Electromigration in Eutectic Tin-Bismuth P..:
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2023 International Conference on Electronics Packaging (ICEP) ,
3
Electromigration in tin-bismuth planar solder joints:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
4
Permeation of moisture out of EPDM rubber hoses:
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2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ,
5
A Case Study of Nickel Dendritic Growth on Printed-Circuit ..:
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2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ,
6
Conformal Coating Characterization Using Stacked Silver Thi..:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
7
Measuring Water Permeation Through EPDM Rubber Hoses:
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8
Materials developments in microelectronic packaging: perfor..
proceedings of the fourth Electronic Materials and Processi...
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