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Sivasubramony, Rajesh Sharma
6  Ergebnisse:
Personensuche X
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1

Early transient creep of single crystal SnAgCu solder joint:

Das, Ronit ; Thekkut, Sanoop ; Sivasubramony, Rajesh Sharma...
Journal of Materials Science: Materials in Electronics.  33 (2022)  17 - p. 13657-13667 , 2022
Link: https://doi.org/10.1007/..
 
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2

Effect of substrate properties on isothermal fatigue of aer..:

Muralidharan, Roshan ; Raj, Arun ; Sivasubramony, Rajesh Sharma...
Journal of Materials Research.  34 (2019)  16 - p. 2903-2910 , 2019
Link: https://doi.org/10.1557/..
 
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3

High Temperature Die Interconnection Approaches:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Alshatnawi, Firas ; Alhendi, Mohammed ; Al-Haidari, Riadh A.... - p. 1539-1545 , 2022
Link: https://doi.org/10.1109/..
 
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4

Assessing Current‐Carrying Capacity of Aerosol Jet Printed ..:

Alhendi, Mohammed ; Sivasubramony, Rajesh S. ; Weerawarne, Darshana L....
Advanced Engineering Materials.  22 (2020)  11 - p. , 2020
Link: https://doi.org/10.1002/..
 
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5

Electrical and Mechanical Behavior of Aerosol Jet–Printed G..:

Alshatnawi, Firas ; Alhendi, Mohammed ; Abbara, El Mehdi...
Advanced Engineering Materials.  25 (2023)  20 - p. , 2023
Link: https://doi.org/10.1002/..
 
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6

Printed electronics for extreme high temperature environmen..:

Alhendi, Mohammed ; Alshatnawi, Firas ; Abbara, El Mehdi...
Additive Manufacturing.  54 (2022)  - p. 102709 , 2022
Link: https://doi.org/10.1016/..
 
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