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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Enabling Socketable BGAs with Eutectic-Forming Bi-based Coa..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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A Study of Chip-Package Interaction with All-Copper Interco..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Impact of Non-Coplanarities on Microstructure and Propertie..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Mitigating Cracking from RDL Stress in Glass Substrates wit..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Bayesian Optimization of Large Glass Package Architecture f..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Magneto-Assisted Graphene Reinforcement: A New Method to En..:
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2023 IEEE Transportation Electrification Conference & Expo (ITEC) ,
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A Multi-Objective, Machine-Learning-Based Optimization Meth..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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High Performance, Multilayer Copper-Graphene Micro-Foam Wic..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Intelligent Multi-Physics Design of 3-D Leadframe- based Si..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Reliability and Failure Analysis of Chip-to-Substrate Cu-Pi..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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CYTOP for bonding highly oriented pyrolytic graphite to be ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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