Smet, Vanessa
48  Ergebnisse:
Personensuche X
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1

Vanadium-Dioxide-Based Reconfigurable Ka-Band Dual-Sense Li..:

Lust, Mark S. ; West, David L. ; Smet, Vanessa..
IEEE Transactions on Antennas and Propagation.  72 (2024)  3 - p. 2468-2480 , 2024
 
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2

Enabling Socketable BGAs with Eutectic-Forming Bi-based Coa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Jaewon ; Smet, Vanessa - p. 1137-1143 , 2024
 
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3

A Study of Chip-Package Interaction with All-Copper Interco..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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4

Impact of Non-Coplanarities on Microstructure and Propertie..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Amirnasiri, Ali ; Sosa, Ramon A. ; Tian, Mengkun.. - p. 2298-2303 , 2024
 
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5

Mitigating Cracking from RDL Stress in Glass Substrates wit..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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6

Bayesian Optimization of Large Glass Package Architecture f..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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7

Magneto-Assisted Graphene Reinforcement: A New Method to En..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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9

A Multi-Objective, Machine-Learning-Based Optimization Meth..:

, In: 2023 IEEE Transportation Electrification Conference & Expo (ITEC),
 
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10

High Performance, Multilayer Copper-Graphene Micro-Foam Wic..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Moss, Alex ; Antoniou, Antonia ; Smet, Vanessa - p. 2087-2092 , 2023
 
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11

Intelligent Multi-Physics Design of 3-D Leadframe- based Si..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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12

Reliability and Failure Analysis of Chip-to-Substrate Cu-Pi..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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13

Solid-state diffusion studies of lead-free solders on gold ..:

Gupte, Omkar ; Murtagian, Gregorio ; Kathaperumal, Mohanalingam..
Journal of Materials Science: Materials in Electronics.  33 (2022)  10 - p. 7679-7690 , 2022
 
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14

CYTOP for bonding highly oriented pyrolytic graphite to be ..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
 
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15

Demonstration of Glass-based 3D Package Architectures with ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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