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Song, Chiuk
5  Ergebnisse:
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1

Conducted Noise Emission Analysis of Interleaved Totem-pole..:

, In: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa),
Song, Chiuk ; Kweon, Hucksu ; Lee, Chung Hyun... - p. 464-467 , 2024
Link: https://doi.org/10.23919..
 
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2

A Modeling Method of Receivers for Conducted Emission Noise..:

, In: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa),
Lee, Chung Hyun ; Song, Chiuk ; Park, Heon Jin. - p. 461-463 , 2024
Link: https://doi.org/10.23919..
 
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3

Modeling and Analysis of High Speed Switching Buck Converte..:

, In: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
Park, Jaehyoung ; Song, Chiuk ; Park, Jonghyun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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4

Modeling of conducted EMI noise in an Automotive LED Driver..:

, In: 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
Song, Chiuk ; Kweon, Hucksu ; Lee, Unho... - p. 1009-1013 , 2019
Link: https://doi.org/10.1109/..
 
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5

Safety and reliability verification process of coil module ..:

, In: 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS),
Kim, Jonghoon ; Kim, Jonghoon J. ; Kim, Hongseok... - p. 144-147 , 2015
Link: https://doi.org/10.1109/..
 
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