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Song, Jun-Yeob
1275  Ergebnisse:
Personensuche X
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1

Optimization of process parameters in micro-scale pneumatic..:

Jeong, Hakyung ; Lee, Jae Hak ; Kim, Seungman...
Scientific Reports.  13 (2023)  1 - p. , 2023
Link: https://doi.org/10.1038/..
 
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2

Finite Element Analysis for Safe Design of a Flexible Micro..:

Kim, Cha-Hee ; Yun, Hyeonji ; Seo, Seung-Ho...
ECS Journal of Solid State Science and Technology.  11 (2022)  4 - p. 045015 , 2022
Link: https://doi.org/10.1149/..
 
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3

Development of a Next Generation Stretchable Substrate for ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Park, Ah-Young ; Lee, Jae Hak ; Song, Jun-Yeob... - p. 36-39 , 2022
Link: https://doi.org/10.1109/..
 
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4

Hybrid Solder with silver hierarchical structure and partic..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jeong, Hakyung ; Lee, Jae Hak ; Kim, Seung Man.. - p. 509-512 , 2022
Link: https://doi.org/10.1109/..
 
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5

Low Height Wire bond Looping Technology using Wedge Bonding..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Park, Ah-Young ; Lee, Jae Hak ; Kim, Seungman... - p. 169-174 , 2022
Link: https://doi.org/10.1109/..
 
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6

Continuous Patterning of Silver Nanowire-Polyvinylpyrrolido..:

Jeong, Hakyung ; Lee, Jae Hak ; Song, Jun-Yeob..
Nanomaterials.  13 (2022)  1 - p. 32 , 2022
Link: https://doi.org/10.3390/..
 
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7

Study on the Embedded Flexible Hybrid Stack Package using P..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Lee, Jae Hak ; Kim, Yong Jin ; Kim, Seung Man. - p. 1-5 , 2019
Link: https://doi.org/10.23919..
 
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8

Evaluation of Crack Propagation at the Interconnection Inte..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Park, Ah-Young ; Lee, Jae Hak ; Song, Jun-Yeob.. - p. 99-102 , 2019
Link: https://doi.org/10.1109/..
 
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9

The effect of laser irradiation on peel strength of tempora..:

Lee, Seung-Woo ; Lee, Tae-Hyung ; Park, Ji-Won...
International Journal of Adhesion and Adhesives.  57 (2015)  - p. 9-12 , 2015
Link: https://doi.org/10.1016/..
 
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10

Curing Behaviors of UV-Curable Temporary Adhesives for a 3D..:

Lee, Seung-Woo ; Lee, Tae-Hyung ; Park, Ji-Won...
Journal of Electronic Materials.  43 (2014)  11 - p. 4246-4254 , 2014
Link: https://doi.org/10.1007/..
 
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11

A new wafer level TSV build-up stacking using oxide bonding:

Kim, Sun-Rak ; Song, Jun-Yeob ; Lee, Seung S.
Journal of Micromechanics and Microengineering.  23 (2013)  6 - p. 065015 , 2013
Link: https://doi.org/10.1088/..
 
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12

Failure mechanism of copper through-silicon vias under bias..:

Seo, Seung-Ho ; Hwang, Joo-Sun ; Yang, Jun-Mo...
Thin Solid Films.  546 (2013)  - p. 14-17 , 2013
Link: https://doi.org/10.1016/..
 
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13

UV-curing and thermal stability of dual curable urethane ep..:

Lee, Seung-Woo ; Park, Ji-Won ; Park, Cho-Hee...
International Journal of Adhesion and Adhesives.  44 (2013)  - p. 138-143 , 2013
Link: https://doi.org/10.1016/..
 
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14

The development of embedded device to detect chatter vibrat..:

Kim, Dong-Hoon ; Song, Jun-Yeob ; Cha, Suk-Keun.
Journal of Mechanical Science and Technology.  25 (2011)  10 - p. 2623-2630 , 2011
Link: https://doi.org/10.1007/..
 
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15

Manufacturing message specification (MMS) based open manufa..:

Kim, Dong-Hoon ; Song, Jun-Yeob ; Cha, Suk-Keun.
International Journal of Precision Engineering and Manufacturing.  11 (2010)  3 - p. 391-395 , 2010
Link: https://doi.org/10.1007/..
 
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