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X
Sprenger, Mario
54  Ergebnisse:
Personensuche X
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1

Testing and simulation of lifetime for wire bond interconne..:

Sippel, Marcel ; Tan, Yi Fong ; Schmidt, Ralf...
Microelectronics Reliability.  155 (2024)  - p. 115348 , 2024
Link: https://doi.org/10.1016/..
 
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2

Modelling Warpage Behavior of Molded Power Modules for Elec..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Forndran, Freerik ; Sprenger, Mario ; Barrera, Juan Ricardo... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

Reliability of Piezojet-Printed Conductive Lines on Alumina..:

, In: 2023 15th International Congress Mechatronic Integration Discourse (MID),
Utsch, Daniel ; Hausler, Felix ; Sprenger, Mario.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

Additive Metallization of Alumina with Copper-Titanium Powd..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Hecht, Christoph ; Schadow, Eric ; Sprenger, Mario... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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5

Influence of the Bond Foot Angle on Active Power Cycling Li..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Sippel, Marcel ; Tan, Yi Fong ; Schmidt, Ralf... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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6

Influence of Current Density on Wire Bond Lifetime in Activ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sippel, Marcel ; Schmidt, Ralf ; Kasbauer, Michael... - p. 799-805 , 2022
Link: https://doi.org/10.1109/..
 
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7

Reliability of lead-free solders for die attach in automoti..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ottinger, Bettina ; Holverscheid, Joshua ; Konig, Sebastian... - p. 409-413 , 2022
Link: https://doi.org/10.1109/..
 
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8

High Temperature Die Attach: Study and Power Cycling of Dir..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Haubler, Felix ; Sippel, Marcel ; Sprenger, Mario... - p. 456-461 , 2022
Link: https://doi.org/10.1109/..
 
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9

Laser Cleaning of Flux Residues on Copper Surfaces in Elect..:

, In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME),
Hecht, Christoph ; Slama, Jan-Niklas ; Sprenger, Mario... - p. 65-69 , 2022
Link: https://doi.org/10.1109/..
 
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10

Parametric study on relevant design and material parameters..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sprenger, Mario ; Noll, Niklas ; Hecht, Christoph... - p. 660-667 , 2022
Link: https://doi.org/10.1109/..
 
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11

Impact of Aluminum Metallization Reconstruction on the Curr..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Sippel, Marcel ; Hassel, Simon ; Schmidt, Ralf... - p. 439-445 , 2022
Link: https://doi.org/10.1109/..
 
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12

MultOpt++: a fast regression-based model for the developmen..:

Müller, Alexander ; Roslyakova, Irina ; Sprenger, Mario...
Modelling and Simulation in Materials Science and Engineering.  27 (2019)  2 - p. 024001 , 2019
Link: https://doi.org/10.1088/..
 
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13

MultOpt++: a fast regression-based model for the developmen..:

Müller, Alexander ; Roslyakova, Irina ; Sprenger, Mario...
https://opus4.kobv.de/opus4-fau/frontdoor/index/index/docId/18278.  , 2019
Link: https://opus4.kobv.de/op..
 
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14

Author Correction: Minimal reporting guideline for research..:

Dunn, Matt J. ; Alexander, Robert G. ; Amiebenomo, Onyekachukwu M....
Behavior Research Methods.  56 (2024)  4 - p. 4218-4219 , 2024
Link: https://doi.org/10.3758/..
 
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15

Impact of consumption of the human milk oligosaccharides 2′..:

Holvoet, Sébastien ; Foata, Francis ; Nutten, Sophie...
Food and Agricultural Immunology.  35 (2024)  1 - p. , 2024
Link: https://doi.org/10.1080/..
 
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