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Stęplewski, Wojciech
27  Ergebnisse:
Personensuche X
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1

Interconnect Stress Testing as a Tool for Assessment of Rel..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Koscielski, Marek ; Glinski, Krzysztof ; Ostaszewski, Dariusz... - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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2

Correction: Technology of Standard SMT Components Embedded ..:

Stęplewski, Wojciech ; Rybak, Andrzej ; Dziedzic, Andrzej...
Journal of Electronic Materials.  52 (2023)  7 - p. 5036-5036 , 2023
Link: https://doi.org/10.1007/..
 
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3

Technology of Standard SMT Components Embedded Into PCB by ..:

Stęplewski, Wojciech ; Rybak, Andrzej ; Dziedzic, Andrzej...
Journal of Electronic Materials.  , 2023
Link: https://doi.org/10.1007/..
 
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4

A comparative analysis of printed circuit drying methods fo..:

Ciszewski, Piotr ; Sochacki, Mariusz ; Stęplewski, Wojciech...
Microelectronics Reliability.  129 (2022)  - p. 114478 , 2022
Link: https://doi.org/10.1016/..
 
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5

Investigations of temperature sensor embedded into PCB:

Janeczek, Kamil ; Araźna, Aneta ; Stęplewski, Wojciech...
Microelectronics International.  37 (2020)  4 - p. 199-204 , 2020
Link: https://doi.org/10.1108/..
 
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6

Traceability of printed circuit board assemblies using embe..:

Janeczek, Kamil ; Araźna, Aneta ; Stęplewski, Wojciech.
IET Microwaves, Antennas & Propagation.  14 (2020)  8 - p. 785-790 , 2020
Link: https://doi.org/10.1049/..
 
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7

Reliability Investigations of a Sensor System Embedded into..:

Janeczek, Kamil ; Araźna, Aneta ; Stęplewski, Wojciech...
physica status solidi (a).  218 (2020)  4 - p. , 2020
Link: https://doi.org/10.1002/..
 
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8

Comparison of SAC and new Pb-free solder alloy for special ..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Arazna, Aneta ; Koscielski, Marek ; Sitek, Anna... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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9

Recovery of valuable BGA components from used electronic mo..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Koscielski, Marek ; Sitek, Janusz ; Ciszewski, Piotr... - p. 1-5 , 2019
Link: https://doi.org/10.23919..
 
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10

Piezoresistive effect in embedded thick-film resistors:

Borecki, Janusz ; Araźna, Aneta ; Janeczek, Kamil...
Circuit World.  45 (2019)  1 - p. 31-36 , 2019
Link: https://doi.org/10.1108/..
 
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11

Thermal stability analysis of passive components embedded i..:

Stęplewski, Wojciech ; Dziedzic, Andrzej ; Janeczek, Kamil...
Circuit World.  44 (2018)  1 - p. 29-36 , 2018
Link: https://doi.org/10.1108/..
 
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12

Circular economy in RFID technology: analysis of recycling ..:

Janeczek, Kamil ; Araźna, Aneta ; Stęplewski, Wojciech
Journal of Adhesion Science and Technology.  33 (2018)  4 - p. 406-417 , 2018
Link: https://doi.org/10.1080/..
 
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13

Assessment of stability and reliability of embedded compone..:

Steplewski, Wojciech ; Dziedzic, Andrzej ; Borecki, Janusz.
Circuit World.  43 (2017)  1 - p. 19-26 , 2017
Link: https://doi.org/10.1108/..
 
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14

Stability of electrical properties for mechanically exposed..:

Dziedzic, Andrzej ; Osypiuk, Pawel ; Steplewski, Wojciech
Soldering & Surface Mount Technology.  29 (2017)  1 - p. 54-58 , 2017
Link: https://doi.org/10.1108/..
 
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15

Influence of mechanical exposures on electrical properties ..:

Osypiuk, Paweł ; Dziedzic, Andrzej ; Stęplewski, Wojciech.
Soldering & Surface Mount Technology.  28 (2016)  1 - p. 33-38 , 2016
Link: https://doi.org/10.1108/..
 
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