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Sueoka, Kuniaki
6  Ergebnisse:
Personensuche X
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1

Analysis of process dependent mechanical properties of sint..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Kohara, Sayuri ; Aoki, Toyohiro ; Marushima, Chinami... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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2

Morphology and Mechanical property of Cu pillar formed by s..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Marushima, Chinami ; Aoki, Toyohiro ; Kohara, Sayuri... - p. 121-122 , 2021
Link: https://doi.org/10.23919..
 
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3

Plating-free Bumping by Cu Nanopaste and Injection Molded S..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Aoki, Toyohiro ; Nakamura, Eiji ; Kohara, Sayuri... - p. 742-748 , 2020
Link: https://doi.org/10.1109/..
 
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4

Development of vacuum underfill technology for a 3D chip st..:

Sakuma, Katsuyuki ; Kohara, Sayuri ; Sueoka, Kuniaki...
Journal of Micromechanics and Microengineering.  21 (2011)  3 - p. 035024 , 2011
Link: https://doi.org/10.1088/..
 
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5

43.1: Color Filterless Liquid Crystal Display Illuminated w..:

Taira, Yoichi ; Numata, Hidetoshi ; Nakano, Daiju...
SID Symposium Digest of Technical Papers.  34 (2003)  1 - p. 1250-1253 , 2003
Link: https://doi.org/10.1889/..
 
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6

Infrared fourier transform emission spectrum of GeS:

Uehara, Hiromichi ; Horiai, Koui ; Sueoka, Kazuo.
Chemical Physics Letters.  160 (1989)  2 - p. 149-151 , 1989
Link: https://doi.org/10.1016/..
 
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