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Suhard, Samuel
23  Ergebnisse:
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1

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
Link: https://doi.org/10.1109/..
 
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2

Multi-tier die stacking through collective die-to-wafer hyb..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Lin, Ye ; Suhard, Samuel... - p. 637-642 , 2024
Link: https://doi.org/10.1109/..
 
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3

Process Challenges During CVD Oxide Deposition on the Backs..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Guerrero, Alice ; Salahouelhadj, Abdellah... - p. 1584-1589 , 2023
Link: https://doi.org/10.1109/..
 
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4

Integration of plasma dicing in the collective die to wafer..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Suhard, Samuel ; Kennes, Koen ; Bex, Pieter... - p. 144-149 , 2023
Link: https://doi.org/10.1109/..
 
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5

Carrier Systems for Collective Die-to-Wafer Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Phommahaxay, Alain ; Guerrero, Alice... - p. 2058-2063 , 2022
Link: https://doi.org/10.1109/..
 
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6

Introduction of a New Carrier System for Collective Die-to-..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Phommahaxay, Alain ; Guerrero, Alice... - p. 296-302 , 2020
Link: https://doi.org/10.1109/..
 
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7

Demonstration of a collective hybrid die-to-wafer integrati..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Suhard, Samuel ; Phommahaxay, Alain ; Kennes, Koen... - p. 1315-1321 , 2020
Link: https://doi.org/10.1109/..
 
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8

Process Complexity and Cost Considerations of Multi-Layer D..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Velenis, Dimitrios ; De Vos, Joeri ; Kim, Soon-Wook... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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9

New approach to apply 1,2,3-benzotriazole as a capping laye..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Shehzad, Adil ; Derakhshandeh, Jaber ; Wunderle, Bernhard... - p. 1-8 , 2019
Link: https://doi.org/10.23919..
 
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10

Protective Layer for Collective Die to Wafer Hybrid Bonding:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Inoue, Fumihiro ; Bertheau, Julien ; Suhard, Samuel... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Interface charge trapping induced flatband voltage shift du..:

Li, Yunlong ; Suhard, Samuel ; Van Huylenbroeck, Stefaan...
Journal of Applied Physics.  122 (2017)  24 - p. , 2017
Link: https://doi.org/10.1063/..
 
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12

3D Stacking Using Bump-Less Process for Sub 10um Pitch Inte..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; De Preter, Inge ; Gerets, Carine... - p. 128-133 , 2016
Link: https://doi.org/10.1109/..
 
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13

(Invited) Vertical Nanowire FET Integration and Device Aspe..:

Veloso, Anabela ; Altamirano-Sánchez, Efraín ; Brus, Stephan...
ECS Transactions.  72 (2016)  4 - p. 31-42 , 2016
Link: https://doi.org/10.1149/..
 
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14

Development of a Wet Silicon Removal Process for Replacemen..:

Suhard, Samuel ; Sebaai, Farid ; Pacco, Antoine...
ECS Transactions.  41 (2011)  5 - p. 51-56 , 2011
Link: https://doi.org/10.1149/..
 
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15

Galvanic Corrosion of PN Junctions during the Dielectric Re..:

Pacco, Antoine ; Sebaai, Farid ; Suhard, Samuel...
ECS Transactions.  41 (2011)  5 - p. 37-43 , 2011
Link: https://doi.org/10.1149/..
 
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