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Sukharev, Valeriy
31  Ergebnisse:
Personensuche X
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1

Warpage Study by Employing an Advanced Simulation Methodolo..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Choy, Jun-Ho ; Moreau, Stéphane ; Brunet-Manquat, Catherine.. - p. 85-90 , 2024
Link: https://dl.acm.org/doi/1..
 
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2

Electromigration Test Chip Experiments from Realistic Power..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Yi, Yong Hyeon ; Kim, Chris ; Kteyan, Armen... - p. 01-06 , 2024
Link: https://doi.org/10.1109/..
 
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3

Electromigration Assessment in Power Grids with Account of ..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Kteyan, Armen ; Sukharev, Valeriy ; Volkov, Alexander... - p. 124-132 , 2023
Link: https://dl.acm.org/doi/1..
 
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4

Studying the Impact of Temperature Gradient on Electromigra..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Yi, Yong Hyeon ; Kim, Chris ; Zhou, Chen.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Effect of interface strength on electromigration-induced in..:

Zschech, Ehrenfried ; Engelmann, Hans-Jürgen ; Meyer, Moritz Andreas...
International Journal of Materials Research.  96 (2022)  9 - p. 966-971 , 2022
Link: https://doi.org/10.1515/..
 
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6

Novel Methodology for Assessing Chip-Package Interaction Ef..:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Kteyan, Armen ; Choy, Jun-Ho ; Sukharev, Valeriy... - p. 83-89 , 2022
Link: https://dl.acm.org/doi/1..
 
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7

Experimental Validation of a Novel Methodology for Electrom..:

Sukharev, Valeriy ; Kteyan, Armen ; Najm, Farid N....
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  41 (2022)  11 - p. 4837-4850 , 2022
Link: https://doi.org/10.1109/..
 
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8

Physics-based simulation of stress-induced and electromigra..:

Kteyan, Armen ; Sukharev, Valeriy
Microelectronic Engineering.  247 (2021)  - p. 111585 , 2021
Link: https://doi.org/10.1016/..
 
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9

Electromigration checking using a stochastic effective curr..:

, In: Proceedings of the 39th International Conference on Computer-Aided Design,
Issa, Adam ; Sukharev, Valeriy ; Najm, Farid N. - p. 1-8 , 2020
Link: https://dl.acm.org/doi/1..
 
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10

Power Grid Fixing for Electromigration-induced Voltage Fail..:

, In: 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD),
Moudallal, Zahi ; Sukharev, Valeriy ; Najm, Farid N. - p. 1-8 , 2019
Link: https://doi.org/10.1109/..
 
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11

An Accurate Assessment of Chip-Package Interaction is a Key..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Sukharev, Valeriy ; Kteyan, Armen ; Choy, Jun-Ho - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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12

Dynamic electromigration modeling for transient stress evol..:

Huang, Xin ; Sukharev, Valeriy ; Kim, Taeyoung.
Integration.  58 (2017)  - p. 518-527 , 2017
Link: https://doi.org/10.1016/..
 
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13

Fast physics-based electromigration assessment by efficient..:

, In: Proceedings of the 36th International Conference on Computer-Aided Design,
Chatterjee, Sandeep ; Sukharev, Valeriy ; Najm, Farid N. - p. 659-666 , 2017
Link: https://dl.acm.org/doi/1..
 
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14

Physics-based full-chip TDDB assessment for BEOL interconne..:

, In: Proceedings of the 53rd Annual Design Automation Conference,
Huang, Xin ; Sukharev, Valeriy ; Qi, Zhongdong.. - p. 1-6 , 2016
Link: https://dl.acm.org/doi/1..
 
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15

Electromigration assessment for power grid networks conside..:

Huang, Xin ; Sukharev, Valeriy ; Choy, Jun-Ho...
Integration.  55 (2016)  - p. 307-315 , 2016
Link: https://doi.org/10.1016/..
 
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