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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Cu/Dielectric hybrid bonding among Glass and Si:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Laser integration on a photonic integrated circuit with hig..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
4
Patterning on reflective (Al) surface using auto alignment ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5
A Precise Wafer Thinning Integration Process for nano-TSV F..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
6
The laser cavity electric connection line with SnAg solder ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
7
Alignment through thick Si layer for high resolution patter..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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