Sundaram, Arvind
238  Ergebnisse:
Personensuche X
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1

Cu/Dielectric hybrid bonding among Glass and Si:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

Laser integration on a photonic integrated circuit with hig..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chi, Ting Ta ; Li, Zhenyu ; Li, Nanxi... - p. 1880-1884 , 2023
 
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4

Patterning on reflective (Al) surface using auto alignment ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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5

A Precise Wafer Thinning Integration Process for nano-TSV F..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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6

The laser cavity electric connection line with SnAg solder ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chi, Ting Ta ; Li, Zhenyu ; Yu, Haitao... - p. 12-15 , 2023
 
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7

Alignment through thick Si layer for high resolution patter..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sundaram, Arvind ; Tew, Chin Khang ; Tan, Guo Wei... - p. 1150-1155 , 2023
 
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13

Line Edge Roughness Optimization of Photonics Components in..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Sundaram, Arvind ; Khang, Tew Chin ; Wei, Tan Guo... - p. 142-145 , 2022
 
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15

Validation of Covert Cognizance Active Defenses:

Sundaram, Arvind ; Abdel-Khalik, Hany
Nuclear Science and Engineering.  195 (2021)  9 - p. 977-989 , 2021
 
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