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Supramaniam, Saraswathy
5  Ergebnisse:
Personensuche X
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1

Moisture Content and Early Corrosion Detection of Cu Wire B..:

Supramaniam, Saraswathy ; Bakar, Maria Abu ; Atiqah, A...
Journal of Failure Analysis and Prevention.  23 (2023)  6 - p. 2362-2369 , 2023
Link: https://doi.org/10.1007/..
 
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2

Acceptance Criteria for Good Solder Joint Reliability On Wa..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Periasamy, Subashini ; Supramaniam, Saraswathy ; Bin Abdullah, Muhammad Nurhisham. - p. 910-917 , 2023
Link: https://doi.org/10.1109/..
 
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3

Measurement of Aluminium Remnant Thickness on Copper Wire B..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Supramaniam, Saraswathy ; Periasamy, Subashini ; Nurhisham, Muhammad.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

Early Corrosion Detection of Cu-Ag Wedge bonding in Semicon..:

Supramaniam, Saraswathy ; Bakar, Maria Abu ; Jalar, Azman
Journal of Failure Analysis and Prevention.  22 (2022)  6 - p. 2317-2325 , 2022
Link: https://doi.org/10.1007/..
 
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5

Package Fault Isolation for Low Density and Non-Metallic Pa..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Supramaniam, Saraswathy ; Bin Abdullah, Muhammad Nurhisham ; Periasamyline, Subashini - p. 1-7 , 2022
Link: https://doi.org/10.1109/..
 
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