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TANIE, Hisashi
11  Ergebnisse:
Personensuche X
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1

Use of Modified Accumulated Damage Model to Predict Fatigue..:

Terasaki, Takeshi ; Tanie, Hisashi ; Chiwata, Nobuhiko..
Transactions of The Japan Institute of Electronics Packaging.  5 (2012)  1 - p. 1-11 , 2012
Link: https://doi.org/10.5104/..
 
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2

Evaluation of Fatigue Strength for Solder Joints on NSMD Pa..:

NAKA, Yasuhiro ; YAGUCHI, Akihiro ; TANIE, Hisashi..
Journal of Solid Mechanics and Materials Engineering.  6 (2012)  5 - p. 339-350 , 2012
Link: https://doi.org/10.1299/..
 
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3

Warpage variations of Si/solder/OFHC-Cu layered plates subj..:

Tanie, Hisashi ; Nakane, Kazuhiko ; Urata, Yusuke..
Microelectronics Reliability.  51 (2011)  9-11 - p. 1840-1844 , 2011
Link: https://doi.org/10.1016/..
 
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4

Thermal ratcheting of solder-bonded layered plates: cyclic ..:

Nakane, Kazuhiko ; Ohno, Nobutada ; Tanie, Hisashi
Computational Mechanics.  46 (2009)  2 - p. 259-268 , 2009
Link: https://doi.org/10.1007/..
 
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5

Molten-Shape Prediction and Fracture-Life Evaluation of Mic..:

TANIE, Hisashi
Journal of Solid Mechanics and Materials Engineering.  3 (2009)  4 - p. 667-678 , 2009
Link: https://doi.org/10.1299/..
 
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6

Fatigue Crack Propagation Analysis for Micro Solder Joints ..:

TERASAKI, Takeshi ; TANIE, Hisashi
Journal of Solid Mechanics and Materials Engineering.  1 (2007)  2 - p. 169-180 , 2007
Link: https://doi.org/10.1299/..
 
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7

Structural design by genetic algorithm:

, In: Inverse Problems in Engineering Mechanics,
Tanie, Hisashi ; Kita, Eisuke - p. 531-540 , 1998
Link: https://doi.org/10.1016/..
 
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8

Shape optimization of continuum structures by genetic algor..:

Kita, Eisuke ; Tanie, Hisashi
Engineering Analysis with Boundary Elements.  19 (1997)  2 - p. 129-136 , 1997
Link: https://doi.org/10.1016/..
 
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9

Proposal of experimental method on fatigue of bonding mater..:

Yu HARUBEPPU ; Hisashi TANIE ; Makoto KITANO
https://www.jstage.jst.go.jp/article/transjsme/86/883/86_19-00330/_pdf/-char/en.  , 2020
Link: https://doi.org/10.1299/..
 
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10

Selection of additive elements for lead-free solders by use..:

Norihiko NONAKA ; Tomio IWASAKI ; Hiroshi MORIYA..
https://www.jstage.jst.go.jp/article/transjsme/81/824/81_15-00018/_pdf/-char/en.  , 2015
Link: https://doi.org/10.1299/..
 
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11

Dominant factor on fracture strength of thin film comprisin..:

Takashi SUMIGAWA ; Emi KAWAI ; Tomoya MARUMO..
https://www.jstage.jst.go.jp/article/transjsme/81/831/81_15-00446/_pdf/-char/en.  , 2015
Link: https://doi.org/10.1299/..
 
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