Tadayon, Pooya
10  Ergebnisse:
Personensuche X
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1

Liquid Metal Interconnects for High Pin Count Scaling and S..:

Nekkanty, Srikant ; Meyyappan, Karumbu ; Mondal, Saikat.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  1 - p. 18-26 , 2024
 
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3

Liquid Metal Based Low Resistance Interconnect Technology:

Meyyappan, Karumbu ; Tadayon, Pooya ; Murtagian, Gregorio...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  4 - p. 465-471 , 2023
 
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5

Detachable Optical Chiplet Connector for Co-Packaged Photon..:

Psaila, Nicholas ; Nekkanty, Srikant ; Shia, David.
Journal of Lightwave Technology.  41 (2023)  19 - p. 6315-6323 , 2023
 
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6

Driving Compute Scale-out Performance with Optical I/O Chip..:

, In: 2023 IEEE Hot Chips 35 Symposium (HCS),
Wade, Mark ; Sun, Chen ; Sysak, Matt... - p. 1-1 , 2023
 
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7

Co-Packaged Photonics For High Performance Computing: Statu..:

Mahajan, Ravi ; Li, Xiaoqian ; Fryman, Joshua...
Journal of Lightwave Technology.  40 (2022)  2 - p. 379-392 , 2022
 
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8

Performances of Two-Phase Cooling Technologies that Uses Wa..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Diglio, Paul ; Shia, David ; Tadayon, Pooya.. - p. 86-92 , 2021
 
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