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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
1
Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packagin:
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2023 IEEE International Conference on Teaching, Assessment and Learning for Engineering (TALE) ,
4
Applying Structural Equation Modelling in Education Researc:
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2023 IEEE International Conference on Teaching, Assessment and Learning for Engineering (TALE) ,
12
Exploring the Role of Reverse Engineering Pedagogy to Integ..:
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2022 IEEE Global Engineering Education Conference (EDUCON) ,
15