E-LIB Suche - Ergebnisse für: Tan, Lipeng

1

Detoxification of coal-tar pitch by alkylation method and t..:

Zhang, Wen-shuo ; Tan, Li-peng ; Shen, Jun...
Chemical Engineering Science. 282 (2023) - p. 119311 , 2023

Link: https://doi.org/10.1016/..

2

Reliability Analysis of Flip-Chip Packaging GaN Chip with N..:

Yan, Lei ; Liu, Peisheng ; Xu, Pengpeng..
Micromachines. 14 (2023) 6 - p. 1245 , 2023

Link: https://doi.org/10.3390/..

3

Heat Dissipation Characteristics of IGBT Module Based on Fl..:

Tan, Lipeng ; Liu, Peisheng ; She, Chenhui...
Micromachines. 13 (2022) 4 - p. 554 , 2022

Link: https://doi.org/10.3390/..

4

Development of LED Package Heat Dissipation Research:

Liu, Peisheng ; She, Chenhui ; Tan, Lipeng..
Micromachines. 13 (2022) 2 - p. 229 , 2022

Link: https://doi.org/10.3390/..

5

Tension-free hiatal hernia repair with biological mesh: A r..:

Cheng, Fahui ; Liang, Hongyan ; Zhang, Yu...
Medicine. 101 (2022) 45 - p. e31782 , 2022

Link: https://doi.org/10.1097/..

6

Research on Heat Dissipation of Multi-Chip LED Filament Pac..:

Tan, Lipeng ; Liu, Peisheng ; She, Chenhui...
Micromachines. 13 (2021) 1 - p. 77 , 2021

Link: https://doi.org/10.3390/..

7

Energy efficiency evaluation of hot-wire laser welding base..:

Wei, Haiying ; Zhang, Yi ; Tan, Lipeng.
Journal of Cleaner Production. 87 (2015) - p. 255-262 , 2015

Link: https://doi.org/10.1016/..

8

Coaxial monitoring of the fibre laser lap welding of Zn-coa..:

Zhang, Yi ; Zhang, Chenglei ; Tan, Lipeng.
Optics & Laser Technology. 50 (2013) - p. 167-175 , 2013

Link: https://doi.org/10.1016/..

9

Reliability Analysis of Flip-Chip Packaging GaN Chip with N..:

Yan, Lei ; Liu, Peisheng ; Xu, Pengpeng..
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC10303685/. , 2023

Link: http://www.ncbi.nlm.nih...

10

Tension-free hiatal hernia repair with biological mesh: A r..:

Cheng, Fahui ; Liang, Hongyan ; Zhang, Yu...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9666108/. , 2022

Link: http://www.ncbi.nlm.nih...

11

Reliability Analysis of Flip-Chip Packaging GaN Chip with N..:

Lei Yan ; Peisheng Liu ; Pengpeng Xu..
A:Physics. , 2023

Link: https://doi.org/10.3390/..

12

Reliability Analysis of Flip-Chip Packaging GaN Chip with N..:

Lei Yan ; Peisheng Liu ; Pengpeng Xu..
https://www.mdpi.com/2072-666X/14/6/1245. , 2023

Link: https://doi.org/10.3390/..

13

Heat Dissipation Characteristics of IGBT Module Based on Fl..:

Lipeng Tan ; Peisheng Liu ; Chenhui She...
https://dx.doi.org/10.3390/mi13040554. , 2022

Link: https://doi.org/10.3390/..

14

Heat Dissipation Characteristics of IGBT Module Based on Fl..:

Lipeng Tan ; Peisheng Liu ; Chenhui She...
https://www.mdpi.com/2072-666X/13/4/554. , 2022

Link: https://doi.org/10.3390/..

15

Development of LED Package Heat Dissipation Research:

Peisheng Liu ; Chenhui She ; Lipeng Tan..
https://dx.doi.org/10.3390/mi13020229. , 2022

Link: https://doi.org/10.3390/..