E-LIB Suche - Ergebnisse für: Tian, Wenchao

1

Surface roughness analysis of Cu seed layer deposited on α-..:

Li, Zhao ; Tian, Wenchao ; Li, Wenbin...
Journal of Applied Physics. 135 (2024) 5 - p. , 2024

Link: https://doi.org/10.1063/..

2

Research on the Reliability of Advanced Packaging under Mul..:

Wang, Yongkun ; Liu, Haozheng ; Huo, Linghua...
Micromachines. 15 (2024) 4 - p. 422 , 2024

Link: https://doi.org/10.3390/..

3

Electrothermal Reliability Analysis of Electromigration in ..:

Zhang, Yiming ; Tian, Wenchao ; Wang, Hongyue...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 1 - p. 157-165 , 2024

Link: https://doi.org/10.1109/..

4

Delamination of Plasticized Devices in Dynamic Service Envi..:

Tian, Wenchao ; Chen, Xuyang ; Zhang, Guoguang..
Micromachines. 15 (2024) 3 - p. 376 , 2024

Link: https://doi.org/10.3390/..

5

High-Frequency Transmission Characteristic Analysis of TSV-..:

Zhang, Yiming ; Tian, Wenchao ; Wang, Hongyue...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 1 - p. 89-97 , 2024

Link: https://doi.org/10.1109/..

6

Surface oxygen vacancy engineering in weak Bi–O bonded ferr..:

Liu, Xiao ; Wang, Jicong ; Zhu, Fangyuan...
Journal of Materials Chemistry A. , 2024

Link: https://doi.org/10.1039/..

7

Dielectric energy storage properties of low-temperature sin..:

Dong, Rizhuang ; Shi, Jing ; Li, Yujing..
Ceramics International. , 2024

Link: https://doi.org/10.1016/..

8

Dielectric, impedance, and ferroelectric performances with ..:

Shi, Jing ; Li, Yujing ; Tian, Wenchao.
Ceramics International. , 2024

Link: https://doi.org/10.1016/..

9

Research and Application of Dual-Packer Single-Layer Volume..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,

Yan, Jian ; Tian, Wen-chao ; Li, Jing-bin - p. 649-656 , 2024

Link: https://doi.org/10.1007/..

10

The Study of the Reliability of Complex Components during t..:

Cui, Hao ; Tian, Wenchao ; Zhang, Yiming.
Micromachines. 14 (2023) 3 - p. 499 , 2023

Link: https://doi.org/10.3390/..

11

The Unified Drive Technology of Multi-bus Sensors Adapted t..:

, In: 2023 IEEE 18th Conference on Industrial Electronics and Applications (ICIEA),

Bai, Zhilu ; Zhang, Guanghui ; Zhang, Wenhua... - p. 1747-1752 , 2023

Link: https://doi.org/10.1109/..

12

Simulation of Single-Event Transient Effect for GaN High-El..:

Wang, Zhiheng ; Cao, Yanrong ; Zhang, Xinxiang...
Micromachines. 14 (2023) 10 - p. 1948 , 2023

Link: https://doi.org/10.3390/..

13

Research of Vertical via Based on Silicon, Ceramic and Glas:

Tian, Wenchao ; Wu, Sixian ; Li, Wenhua
Micromachines. 14 (2023) 7 - p. 1391 , 2023

Link: https://doi.org/10.3390/..

14

Thermal Performance Optimization of Integrated Microchannel..:

Xu, Hanyang ; Huang, Jiabo ; Tian, Wenchao.
Micromachines. 14 (2023) 8 - p. 1498 , 2023

Link: https://doi.org/10.3390/..

15

Effect of P-Type GaN Buried Layer on the Temperature of AlG..:

Lv, Hanghang ; Cao, Yanrong ; Ma, Maodan...
Micromachines. 14 (2023) 7 - p. 1457 , 2023

Link: https://doi.org/10.3390/..