Tobing, Landobasa Y. M.
~ 100  Ergebnisse:
Personensuche X
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3

Wafer scale Ge-on-Si metalens for the mid-infrared:

, In: 2023 Optical Fiber Communications Conference and Exhibition (OFC),
Zhou, Yanyan ; Zhong, Qize ; Ren, Zhihao... - p. 1-3 , 2023
 
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4

Investigation of Immersion Alignment Mark Signal and Alignm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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5

Laser integration on a photonic integrated circuit with hig..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chi, Ting Ta ; Li, Zhenyu ; Li, Nanxi... - p. 1880-1884 , 2023
 
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7

Laser Integration on Silicon through Flip-chip Bonding with..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chi, Ting Ta ; Li, Nanxi ; Cai, Hong... - p. 138-141 , 2022
 
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13

High Order Magnetic and Electric Resonant Modes of Split Ri..:

Tong, Jinchao ; Suo, Fei ; Tobing, Landobasa Y. M....
ACS Applied Materials & Interfaces.  12 (2020)  7 - p. 8835-8844 , 2020
 
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