Tsai, Tsung-Nan
4431  Ergebnisse:
Personensuche X
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1

Measuring machine-group flexibility: a case study for surfa..:

Tsai, Tsung-Nan ; Chen, Long-Hui ; Guh, Ruey-Shiang
Journal of Industrial and Production Engineering.  34 (2017)  4 - p. 261-273 , 2017
 
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3

Toward decentralized intelligence in manufacturing: recent ..:

Liukkonen, Mika ; Tsai, Tsung-Nan
The International Journal of Advanced Manufacturing Technology.  87 (2016)  9-12 - p. 2509-2531 , 2016
 
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5

Optimizing the fine-pitch copper wire bonding process with ..:

Yeh, Jun-Hsien ; Tsai, Tsung-Nan
Microelectronics Reliability.  54 (2014)  1 - p. 287-296 , 2014
 
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6

Selection of the optimal configuration for a flexible surfa..:

Tsai, Tsung-Nan
Computers & Industrial Engineering.  67 (2014)  - p. 146-159 , 2014
 
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7

An adaptive diagnosis system for copper wire bonding proces..:

Tsai, Tsung-Nan
International Journal of Computer Integrated Manufacturing.  26 (2013)  6 - p. 513-526 , 2013
 
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8

Thermal parameters optimization of a reflow soldering profi..:

Tsai, Tsung-Nan
Applied Soft Computing.  12 (2012)  8 - p. 2601-2613 , 2012
 
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9

Development of a soldering quality classifier system using ..:

Tsai, Tsung-Nan
Expert Systems with Applications.  39 (2012)  5 - p. 5727-5738 , 2012
 
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10

A hybrid intelligent approach for optimizing the fine-pitch..:

Tsai, Tsung-Nan
Journal of Intelligent Manufacturing.  25 (2012)  1 - p. 177-192 , 2012
 
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11

Improving the fine-pitch stencil printing capability using ..:

Tsai, Tsung-Nan
Robotics and Computer-Integrated Manufacturing.  27 (2011)  4 - p. 808-817 , 2011
 
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13

MODELING AND OPTIMIZATION OF REFLOW THERMAL PROFILING OPERA..:

Tsai, Tsung-Nan
Journal of the Chinese Institute of Industrial Engineers.  26 (2009)  6 - p. 480-492 , 2009
 
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14

Modeling and optimization of stencil printing operations: A..:

Tsai, Tsung-Nan
Computers & Industrial Engineering.  54 (2008)  3 - p. 374-389 , 2008
 
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15

A KNOWLEDGE-BASED SYSTEM FOR STENCIL PRINTING PROCESS PLANN..:

Tsai, Tsung-Nan
Journal of the Chinese Institute of Industrial Engineers.  24 (2007)  6 - p. 513-521 , 2007
 
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