Tseng, Ya-Ching
3683  Ergebnisse:
Personensuche X
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1

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

A Precise Wafer Thinning Integration Process for nano-TSV F..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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3

Demonstration of a CMOS-Compatible Superconducting Cryogeni..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chui, King-Jien ; Li, Hongyu ; Ng, Yong Chyn... - p. 617-622 , 2023
 
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4

Demonstration and Challenges of Through Si Interposer (TSI)..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tseng, Ya-Ching ; Chui, King-Jien - p. 1067-1070 , 2023
 
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6

Time-Switching Symmetric Transmitter Array to Increase Swee..:

Lu, Hsin-Chia ; Lu, Ling-Zhu ; Cai, Yu-Heng.
IEEE Transactions on Microwave Theory and Techniques.  71 (2023)  2 - p. 881-897 , 2023
 
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7

Four-transmitter time-switching symmetric TX antenna array ..:

, In: 2023 Asia-Pacific Microwave Conference (APMC),
Tseng, Ching-Ya ; Lu, Hsin-Chia - p. 414-416 , 2023
 
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8

High Capacity Data Hiding for AMBTC Decompressed Images Usi..:

, In: Lecture Notes in Networks and Systems; Intelligent Systems and Applications,
 
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10

Defect evolution during through-silicon via copper electrop..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Van Nhat Anh, Tran ; Venkataraman, Nandini ; Tao, Meng... - p. 1059-1062 , 2023
 
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13

Tumor Necrosis Factor-α-Induced C-C Motif Chemokine Ligand ..:

Yang, Chuen-Mao ; Yang, Chien-Chung ; Hsu, Wun-Hsin...
International Journal of Molecular Sciences.  23 (2022)  16 - p. 9086 , 2022
 
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15

A Prototype Design on Privacy-Preserving Outsourced Bayesia..:

, In: 2021 International Conference on Security and Information Technologies with AI, Internet Computing and Big-data Applications; Smart Innovation, Systems and Technologies,
 
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