Tsung, Jason D.
231  Ergebnisse:
Personensuche X
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5

Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Pho..:

, In: 2024 IEEE Silicon Photonics Conference (SiPhotonics),
 
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6

Characterization of 224 Gbps/lambda Interconnects in Co-Pac..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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7

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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8

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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10

Compactly Packaged High-Speed Optical Transceiver Using Sil..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Kim, Do-Won ; Jin, Andy Lim Eu ; Raja, M. Kumarasamy... - p. 1075-1080 , 2016
 
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11

Characterization of Differential TMV Vertical Interconnects..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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12

Evaluating the oral delivery of GalNAc-conjugated siRNAs in..:

Yu, Mikyung ; Qin, June ; Liu, Xiumin...
Nucleic Acids Research.  52 (2024)  10 - p. 5423-5437 , 2024
 
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13

Nanoscale Iron Redistribution during Thermochemical Decompo..:

Luong, Jason ; Wang, Xin ; Tsung, Alicia...
ACS Applied Nano Materials.  6 (2023)  3 - p. 1620-1630 , 2023
 
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15

High Mobility Group Box 1 Release from Hepatocytes during I..:

Evankovich, John ; Cho, Sung W. ; Zhang, Ruilin...
Journal of Biological Chemistry.  285 (2010)  51 - p. 39888-39897 , 2010
 
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