E-LIB Suche - Ergebnisse für: Ugsornrat, Kessararat

1

Enhancement of 8 Leads Small Outline Integrated Circuit Pac..:

, In: 2023 Research, Invention, and Innovation Congress: Innovative Electricals and Electronics (RI2C),

Maneeroth, Nawapat ; Ugsornrat, Kessararat ; Sumithpibul, Chalermsak - p. 273-275 , 2023

Link: https://doi.org/10.1109/..

2

Design, Fabrication and Experimental Study Lab on a Chip by..:

, In: 2023 Research, Invention, and Innovation Congress: Innovative Electricals and Electronics (RI2C),

Boonsiri, Warisara ; Ugsornrat, Kessararat ; Kamsong, Wichayaporn... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

3

Electrochemical Sensing Performances of Screen-Printed Grap..:

Ugsornrat, Kessararat ; Saenkhamai, Anan ; Chantaraklud, Apichaya...
IEEE Sensors Journal. 23 (2023) 23 - p. 28613-28625 , 2023

Link: https://doi.org/10.1109/..

4

A Plastic Based Electrowetting on Dielectric Microchip Inte..:

, In: 2022 Research, Invention, and Innovation Congress: Innovative Electricals and Electronics (RI2C),

Plurksasukkaseam, Triwit ; Ugsornrat, Kessararat ; Tuantranont, Adisorn - p. 85-88 , 2022

Link: https://doi.org/10.1109/..

5

Effect of Molding Compound Material and Roughness Leadframe..:

, In: 2020 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON),

Sukantharat, Anan ; Ugsornrat, Kessararat ; Sumithpibul, Chalermsak - p. 173-176 , 2020

Link: https://doi.org/10.1109/..

6

Effect of Epoxy Molding Compound Material and Roughness Lea..:

Sukantharat, Anan ; Ugsornrat, Kessararat ; Sumithpibul, Chalermsak
ECTI Transactions on Electrical Engineering, Electronics, and Communications. 18 (2020) 2 - p. 179-188 , 2020

Link: https://doi.org/10.37936..

7

Electrowetting-on-dielectric chip with integrated screen-pr..:

Ugsornrat, Kessararat ; Maturos, Thitima ; Pasakon, Patiya...
Materials Science and Engineering: B. 238-239 (2018) - p. 36-41 , 2018

Link: https://doi.org/10.1016/..

8

Effecting aging time of epoxy molding compound to molding p..:

Tachapitunsuk, Jirayu ; Ugsornrat, Kessararat ; Srisuwitthanon, Warayoot.
Journal of Physics: Conference Series. 901 (2017) - p. 012090 , 2017

Link: https://doi.org/10.1088/..

9

Warpage of QFN Package in Post Mold Cure Process of integra..:

Sriwithoon, Nattha ; Ugsornrat, Kessararat ; Srisuwitthanon, Warayoot.
Journal of Physics: Conference Series. 901 (2017) - p. 012089 , 2017

Link: https://doi.org/10.1088/..

10

The Effect of Epoxy Molding Compound Floor Life to Reliabil..:

Peanpunga, Udom ; Ugsornrat, Kessararat ; Thorlor, Panakamol.
Journal of Physics: Conference Series. 901 (2017) - p. 012088 , 2017

Link: https://doi.org/10.1088/..

11

ระบบไฟฟ้าเครื่องกลจุลภาค Microelectromechanical Systems:

Ugsornrat, Kessararat
http://www.ojs.kmutnb.ac.th/index.php/joindtech/article/view/4351/3129. , 2013

Link: http://www.ojs.kmutnb.ac..