E-LIB Suche - Ergebnisse für: Vähäkangas, J.

1

Orienting spins in dually doped monolayer MoS2: from one-si..:

Vähäkangas, J. ; Lantto, P. ; Vaara, J...
Chemical Communications. 53 (2017) 39 - p. 5428-5431 , 2017

Link: https://doi.org/10.1039/..

2

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2...:

Nousiainen, O. ; Kangasvieri, T. ; Rautioaho, R..
Soldering & Surface Mount Technology. 23 (2011) 1 - p. 30-39 , 2011

Link: https://doi.org/10.1108/..

3

Effect of ENIG deposition on the failure mechanisms of ther..:

Nousiainen, O. ; Kangasvieri, T. ; Kautio, K...
Soldering & Surface Mount Technology. 22 (2010) 3 - p. 22-35 , 2010

Link: https://doi.org/10.1108/..

4

Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free com..:

Nousiainen, O. ; Kangasvieri, T. ; Rautioaho, R..
Soldering & Surface Mount Technology. 20 (2008) 3 - p. 11-17 , 2008

Link: https://doi.org/10.1108/..

5

Low‐loss and broadband BGA package transition for LTCC‐SiP ..:

Kangasvieri, T. ; Halme, J. ; Vähäkangas, J..
Microwave and Optical Technology Letters. 50 (2008) 4 - p. 1036-1040 , 2008

Link: https://doi.org/10.1002/..

6

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu sph..:

Nousiainen, O. ; Lehtiniemi, L. ; Kangasvieri, T...
Microelectronics Reliability. 48 (2008) 4 - p. 622-630 , 2008

Link: https://doi.org/10.1016/..

7

Chip cooling with integrated carbon nanotube microfin archi..:

Kordás, K. ; Tóth, G. ; Moilanen, P....
Applied Physics Letters. 90 (2007) 12 - p. , 2007

Link: https://doi.org/10.1063/..

8

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plas..:

NOUSIAINEN, O. ; PUTAALA, J. ; KANGASVIERI, T...
Journal of Electronic Materials. 36 (2007) 3 - p. 232-241 , 2007

Link: https://doi.org/10.1007/..

9

Miniaturized low‐loss Wilkinson power divider for RF front‐..:

Kangasvieri, T. ; Hautajärvi, I. ; Jantunen, H..
Microwave and Optical Technology Letters. 48 (2006) 4 - p. 660-663 , 2006

Link: https://doi.org/10.1002/..

10

Reliability and RF performance of BGA solder joints with pl..:

Kangasvieri, T. ; Nousiainen, O. ; Putaala, J...
Microelectronics Reliability. 46 (2006) 8 - p. 1335-1347 , 2006

Link: https://doi.org/10.1016/..

11

Metallurgical reactions in composite 90Pb10Sn/lead-free sol..:

Nousiainen, O. ; Putaala, J. ; Kangasvieri, T...
Journal of Electronic Materials. 35 (2006) 10 - p. 1857-1865 , 2006

Link: https://doi.org/10.1007/..

12

Laser soldering of flip-chips:

Kordás, K. ; Pap, A.E. ; Tóth, G....
Optics and Lasers in Engineering. 44 (2006) 2 - p. 112-121 , 2006

Link: https://doi.org/10.1016/..

13

Thermal oxidation of porous silicon: Study on structure:

Pap, A. E. ; Kordás, K. ; Tóth, G....
Applied Physics Letters. 86 (2005) 4 - p. 041501 , 2005

Link: https://doi.org/10.1063/..

14

Carbon nanotube synthesis on oxidized porous silicon:

Kordás, K. ; Pap, A.E. ; Vähäkangas, J...
Applied Surface Science. 252 (2005) 5 - p. 1471-1475 , 2005

Link: https://doi.org/10.1016/..

15

Design aspects of microwave components with LTCC technique:

Jantunen, H. ; Kangasvieri, T. ; Vähäkangas, J..
Journal of the European Ceramic Society. 23 (2003) 14 - p. 2541-2548 , 2003

Link: https://doi.org/10.1016/..