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Vandevelde, B.
135  Ergebnisse:
Personensuche X
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1

Digital Twin Technology in Electronics:

, In: Recent Advances in Microelectronics Reliability,
Moeller, H. ; Inamdar, A. ; van Driel, W. D.... - p. 283-321 , 2024
Link: https://doi.org/10.1007/..
 
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2

Impact of experimental conditions for the occurrence of stu..:

, In: 2021 21th European Conference on Radiation and Its Effects on Components and Systems (RADECS),
Guillermin, J. ; Coic, L. ; Vandevelde, B... - p. 1-8 , 2021
Link: https://doi.org/10.1109/..
 
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3

High Current Events Triggered by Heavy Ion Microbeam and Pu..:

, In: 2020 20th European Conference on Radiation and Its Effects on Components and Systems (RADECS),
Mauguet, M. ; Guillermin, J. ; Vandevelde, B.... - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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4

Risk Assessment of Electron Induced SEE during the JUICE Mi..:

, In: 2018 18th European Conference on Radiation and Its Effects on Components and Systems (RADECS),
Sukhaseum, N. ; Vandevelde, B. ; Salvy, L.... - p. 1-7 , 2018
Link: https://doi.org/10.1109/..
 
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5

High Current Event and Single Event Functional Interrupt in..:

, In: 2018 18th European Conference on Radiation and Its Effects on Components and Systems (RADECS),
Guillermin, J. ; Vandevelde, B. ; Chatry, N.... - p. 1-8 , 2018
Link: https://doi.org/10.1109/..
 
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6

TCAD simulation of radiation-induced leakage current in 1T1..:

Nguyen, Hoang T. ; Rodriguez, A. ; Wrobel, F....
Microelectronics Reliability.  88-90 (2018)  - p. 974-978 , 2018
Link: https://doi.org/10.1016/..
 
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7

Improved and accurate physics-of-failure (PoF) methodology ..:

Temsamani, A.B. ; Kauffmann, S. ; Descas, Y....
Microelectronics Reliability.  76-77 (2017)  - p. 42-46 , 2017
Link: https://doi.org/10.1016/..
 
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8

Does the performance of upper limb capture functional varia..:

James, M. ; Mayhew, A. ; Moat, D....
Neuromuscular Disorders.  27 (2017)  - p. S145-S146 , 2017
Link: https://doi.org/10.1016/..
 
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9

North Star Assessment for dysferlinopathy: Longitudinal per..:

James, M. ; Mayhew, A. ; Eagle, M....
Neuromuscular Disorders.  27 (2017)  - p. S145 , 2017
Link: https://doi.org/10.1016/..
 
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10

B-Spline X-Ray Diffraction Imaging — Rapid non-destructive ..:

Cowley, A. ; Ivankovic, A. ; Wong, C.S....
Microelectronics Reliability.  59 (2016)  - p. 108-116 , 2016
Link: https://doi.org/10.1016/..
 
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11

A multilevel sub-modeling approach to evaluate 3D IC packag..:

Lofrano, M. ; Vandevelde, B. ; Gonzalez, M.
Microelectronic Engineering.  120 (2014)  - p. 85-89 , 2014
Link: https://doi.org/10.1016/..
 
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12

MEMS packaging and reliability: An undividable couple:

Tilmans, H.A.C. ; De Coster, J. ; Helin, P....
Microelectronics Reliability.  52 (2012)  9-10 - p. 2228-2234 , 2012
Link: https://doi.org/10.1016/..
 
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13

Fine grain thermal modeling and experimental validation of ..:

Oprins, H. ; Srinivasan, A. ; Cupak, M....
Microelectronics Journal.  42 (2011)  4 - p. 572-578 , 2011
Link: https://doi.org/10.1016/..
 
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14

Cu pumping in TSVs: Effect of pre-CMP thermal budget:

De Wolf, I. ; Croes, K. ; Varela Pedreira, O....
Microelectronics Reliability.  51 (2011)  9-11 - p. 1856-1859 , 2011
Link: https://doi.org/10.1016/..
 
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15

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA package:

Andersson, C. ; Vandevelde, B. ; Noritake, C....
Soldering & Surface Mount Technology.  21 (2009)  2 - p. 28-38 , 2009
Link: https://doi.org/10.1108/..
 
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