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X
Verhaverbeke, Steven
16  Ergebnisse:
Personensuche X
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1

Signal & Power Integrity Optimization Utilizing Silicon Cor..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ayers, Seann ; Verhaverbeke, Steven ; Chen, Han-Wen.. - p. 279-284 , 2024
Link: https://doi.org/10.1109/..
 
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2

Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polym..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Harish, Vineeth ; Sahoo, Krutikesh ; Zheng, Kai... - p. 2178-2183 , 2024
Link: https://doi.org/10.1109/..
 
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3

Optimization of 2.5D Organic Interposer Channel for Die and..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sitaraman, Srikrishna ; Verhaverbeke, Steven ; Banna, Samer... - p. 1316-1322 , 2022
Link: https://doi.org/10.1109/..
 
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4

Novel CMP Material Solution To Enable High Removal Rate Die..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chakraborty, Tapash ; Verhaverbeke, Steven ; Chen, Han-Wen. - p. 540-541 , 2022
Link: https://doi.org/10.1109/..
 
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5

Low Temperature Cu/SiO2 Hybrid Bonding with Metal Passivati..:

, In: 2020 IEEE Symposium on VLSI Technology,
Liu, Demin ; Chen, Po-Chi ; Hsiung, Chien-Kang... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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6

New and Unique CMP Material Solution for the Enablement of ..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Chakraborty, Tapash ; Goradia, Prerna ; Verhaverbeke, Steven... - p. 41-43 , 2020
Link: https://doi.org/10.1109/..
 
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7

(Invited) Supercritical Drying: A Sustainable Solution to P..:

Chen, Han-Wen ; Verhaverbeke, Steven ; Gouk, Roman...
ECS Transactions.  69 (2015)  8 - p. 119-130 , 2015
Link: https://doi.org/10.1149/..
 
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8

Contactless bottom-up electrodeposition of nickel for 3D in..:

Zhao, Mingrui ; Balachandran, Rajesh ; Patterson, Zach...
RSC Advances.  5 (2015)  56 - p. 45291-45299 , 2015
Link: https://doi.org/10.1039/..
 
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9

Development of an All-Wet-Etch Process Chemistry for the Pa..:

Leschkies, Kurtis ; Verhaverbeke, Steven ; Yim, D. K....
ECS Transactions.  58 (2013)  7 - p. 287-297 , 2013
Link: https://doi.org/10.1149/..
 
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10

Non-Stiction Performance of Various Post Wet-Clean Drying S..:

Chen, Han-Wen ; Gouk, Roman ; Verhaverbeke, Steven.
ECS Transactions.  58 (2013)  6 - p. 205-211 , 2013
Link: https://doi.org/10.1149/..
 
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11

Facile Synthesis of Bimetallic Ag/Ni Core/Sheath Nanowires ..:

McKiernan, Maureen ; Zeng, Jie ; Ferdous, Sunzida...
Small.  6 (2010)  17 - p. 1927-1934 , 2010
Link: https://doi.org/10.1002/..
 
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12

Cleaning of Trace Metallic Impurities from Solid Substrates..:

, In: Handbook for Cleaning/Decontamination of Surfaces,
Verhaverbeke, Steven - p. 485-538 , 2007
Link: https://doi.org/10.1016/..
 
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13

Novel Wet Photoresist Strip for Wafer Level Packaging:

Verhaverbeke, Steven ; Zhao, Jun
ECS Transactions.  11 (2007)  2 - p. 235-238 , 2007
Link: https://doi.org/10.1149/..
 
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14

Improvement of Rinsing Efficiency after Sulfuric Acid Hydro..:

Messoussi, Rochdi ; Verhaverbeke, Steven ; Yabune, Tatsuhiro..
Japanese Journal of Applied Physics.  35 (1996)  4R - p. 1989 , 1996
Link: https://doi.org/10.1143/..
 
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15

Critical Parameters for Obtaining Low Particle Densities on..:

Alay, Josep-Lluís ; Verhaverbeke, Steven ; Vandervorst, Wilfried.
Japanese Journal of Applied Physics.  32 (1993)  1S - p. 358 , 1993
Link: https://doi.org/10.1143/..
 
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