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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
9
Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Coolin..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
12
Development of Crossflow Manifold for Two-Phase Liquid Cool..:
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Lecture Notes in Civil Engineering; ICSCEA 2021 ,
13
Promote the Value of Planning and Landscape Architecture Un..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
14