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Wang, Ericbill
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2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Su..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Varma, Anshul ; Gururajarao, Sumanth ; Chen, HsinChen... - p. 36-38 , 2024
Link: https://doi.org/10.1109/..
 
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14.4 A Fully Digital Current Sensor Offering Per-Core Runti..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lu, Chien-Yu ; Huang, Bo-Jr ; Chen, Min-Chieh... - p. 260-262 , 2024
Link: https://doi.org/10.1109/..
 
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2.2 A 5G Mobile Gaming-Centric SoC with High-Performance Th..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Huang, Bo-Jr ; Tsai, Alfred ; Hsieh, Lear... - p. 40-42 , 2023
Link: https://doi.org/10.1109/..
 
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A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integr..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Nayak, Ashish ; Chen, HsinChen ; Mair, Hugh... - p. 50-52 , 2022
Link: https://doi.org/10.1109/..
 
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2.5 A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subs..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Mair, Hugh ; Wang, Ericbill ; Nayak, Ashish... - p. 50-52 , 2020
Link: https://doi.org/10.1109/..
 
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3.4 A 10nm FinFET 2.8GHz tri-gear deca-core CPU complex wit..:

, In: 2017 IEEE International Solid-State Circuits Conference (ISSCC),
Mair, Hugh ; Lin, Gordon ; Thippana, Achuta... - p. 56-57 , 2017
Link: https://doi.org/10.1109/..
 
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Dimensity 9000 – A Flagship Smartphone SoC:

, In: 2022 IEEE Hot Chips 34 Symposium (HCS),
Ericbill Wang, Mediatek ; Rosinger, Arm Stefan ; Pradhan, Saurabh - p. 1-23 , 2022
Link: https://doi.org/10.1109/..
 
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