Wang, Fangcheng
619  Ergebnisse:
Personensuche X
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6

A Single-layer Photosensitive Polymer Material for Temporar..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Xuefan ; Liu, Qiang ; Wang, Fangcheng... - p. 1-4 , 2023
 
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9

Effect of Different Defects in Temporary Bonding on Laser D..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Jieyuan ; Wang, Fangcheng ; Liu, Qiang... - p. 1-4 , 2023
 
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10

Ablation Behaviour of Photosensitive Materials in Laser Deb..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Fangcheng ; Liu, Qiang ; Wang, Xuefan... - p. 1-5 , 2023
 
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12

Temporary bonding system with photopolymer release layer fo..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Xuefan ; Liu, Qiang ; Wang, Fangcheng... - p. 1-5 , 2022
 
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